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Silicon Etchants

Nitric Acid Etching Mixture (81104)

SEF 555-223-222, VLSI

General Information

  • CAS Number
    • 7697-37-2

Physical Properties

  • Melting Point/Range
    • No data available
  • Flashpoint
    • Not applicable
  • Physical Form
    • Liquid
  • Color
    • Colorless
  • Odor
    • Stinging
  • Boiling Point/Range
    • No data available

Safety Information

  • Ignition Temperature
    • Not applicable
  • Incompatible Materials
    • Reactions with combustible substances, Glass and silicate-containing materials are attacked, Hydrogen by reaction with metals
  • Corrosivity
    • Corrosive to metals
  • Thermal Decomposition
    • To avoid thermal decomposition, do not overheat.

International Transportation

  • Harmonized System Code
    • 38249996
  • Chemical Class
    • 8
  • Packing Group
    • II
  • Sub Class 1
    • 6.1
  • UN Number
    • 2922

General Information

  • CAS Number
    • 7697-37-2

Physical Properties

  • Melting Point/Range
    • No data available
  • Flashpoint
    • Not applicable
  • Physical Form
    • Liquid
  • Color
    • Colorless
  • Odor
    • Stinging
  • Boiling Point/Range
    • No data available

Safety Information

  • Ignition Temperature
    • Not applicable
  • Incompatible Materials
    • Reactions with combustible substances, Glass and silicate-containing materials are attacked, Hydrogen by reaction with metals
  • Corrosivity
    • Corrosive to metals
  • Thermal Decomposition
    • To avoid thermal decomposition, do not overheat.

International Transportation

  • Harmonized System Code
    • 38249996
  • Chemical Class
    • 8
  • Packing Group
    • II
  • Sub Class 1
    • 6.1
  • UN Number
    • 2922
  • CAS Number : 7697-37-2
  • Melting Point/Range : No data available
  • Flashpoint : Not applicable
  • Physical Form : Liquid
  • Color : Colorless
  • Odor : Stinging
  • Boiling Point/Range : No data available
  • Ignition Temperature : Not applicable
  • Incompatible Materials : Reactions with combustible substances, Glass and silicate-containing materials are attacked, Hydrogen by reaction with metals
  • Corrosivity : Corrosive to metals
  • Thermal Decomposition : To avoid thermal decomposition, do not overheat.
  • Harmonized System Code : 38249996
  • Chemical Class : 8
  • Packing Group : II
  • Sub Class 1 : 6.1
  • UN Number : 2922
Sales Sheet
Name
Description
File Size
Date
Size
Texture Etch-wafer thinning materials
application/pdf 961.61 KB
5/5/2022
961.61 KB
Texture Etch-wafer thinning materials
application/pdf 961.61 KB
9/14/2022
961.61 KB
Name
Description
File Size
Date
Size
Texture Etch-wafer thinning materials
961.61 KB
5/5/2022
961.61 KB
Texture Etch-wafer thinning materials
961.61 KB
9/14/2022
961.61 KB
Name
Description
File Size
Date
Size
Texture Etch-wafer thinning materials
961.61 KB
5/5/2022
Texture Etch-wafer thinning materials
961.61 KB
9/14/2022
Property
Value
particles > 0,5 µm
Max. 500 P/ml
particles > 1 µm
Max. 25 P/ml
assay of HNO3
42.3 - 43.8 %
assay of acetic acid
17.5 - 19.1 %
assay hydrofluoric acid (HF)
9.6 - 10.5 %
silver (Ag)
Max. 0.30 ppm
aluminium (Al)
Max. 0.30 ppm
arsenic (As)
Max. 0.03 ppm
gold (Au)
Max. 0.30 ppm
boron (B)
Max. 0.20 ppm
barium (Ba)
Max. 0.30 ppm
calcium (Ca)
Max. 0.30 ppm
cadmium (Cd)
Max. 0.30 ppm
cobalt (Co)
Max. 0.30 ppm
chromium (Cr)
Max. 0.20 ppm
copper (Cu)
Max. 0.10 ppm
iron (Fe)
Max. 0.30 ppm
gallium (Ga)
Max. 0.30 ppm
germanium (Ge)
Max. 0.30 ppm
potassium (K)
Max. 0.30 ppm
lithium (Li)
Max. 0.30 ppm
magnesium (Mg)
Max. 0.30 ppm
manganese (Mn)
Max. 0.30 ppm
sodium (Na)
Max. 0.30 ppm
nickel (Ni)
Max. 0.30 ppm
lead (Pb)
Max. 0.30 ppm
antimony (Sb)
Max. 0.03 ppm
tin (Sn)
Max. 0.30 ppm
strontium (Sr)
Max. 0.30 ppm
titanium (Ti)
Max. 0.30 ppm
zinc (Zn)
Max. 0.30 ppm