Our Thermal Interface Materials (TIMs) offer Phase Change Materials (PCM), thermal hybrid gels, thermal filler gap pads, grease, and heat transfer paste to eliminate air gaps and reduce localized areas of high thermal resistance. 

The key applications and products are as follows:

Low Alpha Materials
Honeywell RadLo™ materials include solder material of various low alpha grades for devices challenged by soft errors.
The applications include:

• Solder microspheres
• Copper pillar solder caps

Honeywell’s development team can partner with customers, including electroplating systems manufacturers, to create custom alloys for all form factors.

Semiconductor fabrication involves the manufacturing process of semiconductor devices, such as integrated circuits (ICs) and microchips, which are fundamental components of modern electronics. This highly intricate process entails the precise deposition, patterning, and etching of various materials on semiconductor substrates.

Targets
High-purity physical vapor deposition technique (PVD) sputtering targets and coil sets such as Aluminum (Al) alloys, Copper (Cu), Copper (Cu) alloys, Tantalum (Ta), Titanium (Ti), Tungsten (W).

Thermocouples
Honeywell Electronic Materials offers a unique SWAP program that makes it easier to do business with by streamlining thermocouple management.

Etchants
Etchant blends selectively and uniformly remove substrates without damaging underlying layers, which is critical to wafer manufacturing. Our blending expertise ranges from mainstream etchants to unique blends for customer-specific applications.

Electronic Chemicals
Explore the broadest range of ultra-high purity (UHP) chemistries for electronics and semiconductors. Meticulous quality controls ensure supply reliability and superior performance. Our flexible, streamlined facilities can tailor your application-specific products with customizable package sizes, volumes, substrates, and designs.