Silicon Etchants
Nitric Acid Etching Mixture (17808)
857-143 Puranal
Overview
Specifications
General Information
- Grade
- SemEG
Physical Properties
- Boiling Point/Range
- No data available
- Color
- Colorless
- Density
- 1.380 g/cm3 (20 °C)
- Flashpoint
- Not applicable
- Melting Point/Range
- No data available
- Odor
- Stinging
- Partition Coefficient
- No data available
- pH
- Acidic
- Physical Form
- Liquid
- Solubility in Water
- Completely miscible
- Vapor Pressure
- No data available hectopascal
Safety Information
- Corrosivity
- Corrosive to metals
- Flammability
- Not applicable
- Ignition Temperature
- Not applicable
- Incompatible Materials
- Reactions with combustible substances, Glass and silicate-containing materials are attacked, Hydrogen by reaction with metals
- Self Ignition
- Not auto-flammable
- Thermal Decomposition
- To avoid thermal decomposition, do not overheat.
International Transportation
- Chemical Class
- 8
- Harmonized System Code
- 38249996
- Packing Group
- II
- Sub Class 1
- 6.1
- UN Number
- 2922
General Information
- Grade
- SemEG
Physical Properties
- Boiling Point/Range
- No data available
- Color
- Colorless
- Density
- 1.380 g/cm3 (20 °C)
- Flashpoint
- Not applicable
- Melting Point/Range
- No data available
- Odor
- Stinging
- Partition Coefficient
- No data available
- pH
- Acidic
- Physical Form
- Liquid
- Solubility in Water
- Completely miscible
- Vapor Pressure
- No data available hectopascal
Safety Information
- Corrosivity
- Corrosive to metals
- Flammability
- Not applicable
- Ignition Temperature
- Not applicable
- Incompatible Materials
- Reactions with combustible substances, Glass and silicate-containing materials are attacked, Hydrogen by reaction with metals
- Self Ignition
- Not auto-flammable
- Thermal Decomposition
- To avoid thermal decomposition, do not overheat.
International Transportation
- Chemical Class
- 8
- Harmonized System Code
- 38249996
- Packing Group
- II
- Sub Class 1
- 6.1
- UN Number
- 2922
- Grade : SemEG
- Melting Point/Range : No data available
- Vapor Pressure : No data available hectopascal
- Partition Coefficient : No data available
- Density : 1.380 g/cm3 (20 °C)
- Boiling Point/Range : No data available
- pH : Acidic
- Solubility in Water : Completely miscible
- Physical Form : Liquid
- Odor : Stinging
- Color : Colorless
- Flashpoint : Not applicable
- Incompatible Materials : Reactions with combustible substances, Glass and silicate-containing materials are attacked, Hydrogen by reaction with metals
- Corrosivity : Corrosive to metals
- Self Ignition : Not auto-flammable
- Flammability : Not applicable
- Ignition Temperature : Not applicable
- Thermal Decomposition : To avoid thermal decomposition, do not overheat.
- Sub Class 1 : 6.1
- Harmonized System Code : 38249996
- Chemical Class : 8
- Packing Group : II
- UN Number : 2922
Sales Sheet
Name
Description
File Size
Date
Size
Texture Etch-wafer thinning materials
application/pdf 961.5 KB
10/31/2023
961.5 KB
Name
Description
File Size
Date
Size
Texture Etch-wafer thinning materials
961.5 KB
10/31/2023
961.5 KB
Name
Description
File Size
Date
Size
Texture Etch-wafer thinning materials
961.5 KB
10/31/2023
