Silicon Etchants
Nitric Acid Etching Mixture (17764)
SPF 64(65)-19-17(40) MOS Puranal
Overview
Specifications
General Information
- Grade
- SemEG
Physical Properties
- Boiling Point/Range
- > 100 °C (1,013 hPa)
- Color
- Colorless
- Density
- 1.410 g/cm3 (20 °C)
- Flashpoint
- Not applicable
- Melting Point/Range
- No data available
- Odor
- Stinging
- pH
- Acidic
- Physical Form
- Liquid
Safety Information
- Corrosivity
- Corrosive to metals
- Ignition Temperature
- Not applicable
- Incompatible Materials
- Corrosive in contact with metals, Glass and silicate-containing materials are attacked
- Thermal Decomposition
- No decomposition if used as directed.
International Transportation
- Chemical Class
- 8
- Harmonized System Code
- 38249996
- Packing Group
- II
- Sub Class 1
- 6.1
- UN Number
- 2922
General Information
- Grade
- SemEG
Physical Properties
- Boiling Point/Range
- > 100 °C (1,013 hPa)
- Color
- Colorless
- Density
- 1.410 g/cm3 (20 °C)
- Flashpoint
- Not applicable
- Melting Point/Range
- No data available
- Odor
- Stinging
- pH
- Acidic
- Physical Form
- Liquid
Safety Information
- Corrosivity
- Corrosive to metals
- Ignition Temperature
- Not applicable
- Incompatible Materials
- Corrosive in contact with metals, Glass and silicate-containing materials are attacked
- Thermal Decomposition
- No decomposition if used as directed.
International Transportation
- Chemical Class
- 8
- Harmonized System Code
- 38249996
- Packing Group
- II
- Sub Class 1
- 6.1
- UN Number
- 2922
- Grade : SemEG
- pH : Acidic
- Melting Point/Range : No data available
- Boiling Point/Range : > 100 °C (1,013 hPa)
- Physical Form : Liquid
- Flashpoint : Not applicable
- Density : 1.410 g/cm3 (20 °C)
- Color : Colorless
- Odor : Stinging
- Incompatible Materials : Corrosive in contact with metals, Glass and silicate-containing materials are attacked
- Thermal Decomposition : No decomposition if used as directed.
- Ignition Temperature : Not applicable
- Corrosivity : Corrosive to metals
- Harmonized System Code : 38249996
- Chemical Class : 8
- Packing Group : II
- Sub Class 1 : 6.1
- UN Number : 2922
Sales Sheet
Name
Description
File Size
Date
Size
Texture Etch-wafer thinning materials
application/pdf 961.5 KB
10/31/2023
961.5 KB
Name
Description
File Size
Date
Size
Texture Etch-wafer thinning materials
961.5 KB
10/31/2023
961.5 KB
Name
Description
File Size
Date
Size
Texture Etch-wafer thinning materials
961.5 KB
10/31/2023
