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Silicon Etchants

Nitric Acid Etching Mixture (17383)

SWF 200-600-200, VLSI Puranal

Overview
Specifications

General Information

  • Grade
    • VLSI

Physical Properties

  • Boiling Point/Range
    • No data available
  • Color
    • Colorless to Yellowish
  • Density
    • 1.12 g/cm3 (20 °C)
  • Flashpoint
    • Not applicable
  • Melting Point/Range
    • No data available
  • Odor
    • Stinging
  • Partition Coefficient
    • No data available
  • pH
    • < 1
  • Physical Form
    • Liquid
  • Solubility in Water
    • Completely miscible
  • Vapor Pressure
    • No data available hectopascal

Safety Information

  • Corrosivity
    • Corrosive to metals
  • Flammability
    • Not applicable
  • Ignition Temperature
    • Not applicable
  • Incompatible Materials
    • Evolution of toxic gases/vapours, Hydrogen by reaction with metals, Glass and silicate-containing materials are attacked
  • Oxidizing
    • The substance or mixture is not classified as oxidizing.
  • Self Ignition
    • Not auto-flammable
  • Thermal Decomposition
    • To avoid thermal decomposition, do not overheat.

International Transportation

  • Chemical Class
    • 8
  • Harmonized System Code
    • 38249996
  • Packing Group
    • II
  • Sub Class 1
    • 6.1
  • UN Number
    • 2922

General Information

  • Grade
    • VLSI

Physical Properties

  • Boiling Point/Range
    • No data available
  • Color
    • Colorless to Yellowish
  • Density
    • 1.12 g/cm3 (20 °C)
  • Flashpoint
    • Not applicable
  • Melting Point/Range
    • No data available
  • Odor
    • Stinging
  • Partition Coefficient
    • No data available
  • pH
    • < 1
  • Physical Form
    • Liquid
  • Solubility in Water
    • Completely miscible
  • Vapor Pressure
    • No data available hectopascal

Safety Information

  • Corrosivity
    • Corrosive to metals
  • Flammability
    • Not applicable
  • Ignition Temperature
    • Not applicable
  • Incompatible Materials
    • Evolution of toxic gases/vapours, Hydrogen by reaction with metals, Glass and silicate-containing materials are attacked
  • Oxidizing
    • The substance or mixture is not classified as oxidizing.
  • Self Ignition
    • Not auto-flammable
  • Thermal Decomposition
    • To avoid thermal decomposition, do not overheat.

International Transportation

  • Chemical Class
    • 8
  • Harmonized System Code
    • 38249996
  • Packing Group
    • II
  • Sub Class 1
    • 6.1
  • UN Number
    • 2922
  • Grade : VLSI
  • Odor : Stinging
  • Flashpoint : Not applicable
  • Partition Coefficient : No data available
  • Color : Colorless to Yellowish
  • pH : < 1
  • Boiling Point/Range : No data available
  • Vapor Pressure : No data available hectopascal
  • Physical Form : Liquid
  • Solubility in Water : Completely miscible
  • Melting Point/Range : No data available
  • Density : 1.12 g/cm3 (20 °C)
  • Corrosivity : Corrosive to metals
  • Self Ignition : Not auto-flammable
  • Incompatible Materials : Evolution of toxic gases/vapours, Hydrogen by reaction with metals, Glass and silicate-containing materials are attacked
  • Flammability : Not applicable
  • Ignition Temperature : Not applicable
  • Thermal Decomposition : To avoid thermal decomposition, do not overheat.
  • Oxidizing : The substance or mixture is not classified as oxidizing.
  • Harmonized System Code : 38249996
  • Chemical Class : 8
  • UN Number : 2922
  • Sub Class 1 : 6.1
  • Packing Group : II
Sales Sheet
Name
Description
File Size
Date
Size
Texture Etch-wafer thinning materials
application/pdf 961.5 KB
10/31/2023
961.5 KB
Name
Description
File Size
Date
Size
Texture Etch-wafer thinning materials
961.5 KB
10/31/2023
961.5 KB
Name
Description
File Size
Date
Size
Texture Etch-wafer thinning materials
961.5 KB
10/31/2023