ADVANCED MATERIALS
ACHIEVE SUPERIOR THERMAL PERFORMANCE WITH
HONEYWELL TIM 1.5 PHASE CHANGE MATERIAL (PCM)
Improve thermal conductivity and heat dissipation in powerful semiconductors with the Honeywell Phase Change Material (PCM)
Poor thermal management in semiconductors can lead to reduced performance. Issues such as throttling, accelerated hardware degradation, increased risk of device failure, high operational costs, and potential system downtime are some of the challenges caused by poor thermal management.
Honeywell Phase Change Material (PCM) – PTM600, PTM7950, PTM7900 and PTM7000 are engineered for superior thermal performance in the following applications:
- Data servers, High-Performance Computing (HPC) using AI chips
- Electric Vehicles (EVs)
- Inverters
- On-Board Charger (OBC)
- Advanced Driver-Assistance Systems (ADAS)
- Consumer electronics
- High-performance laptops
- Gaming consoles
- Smartphones
What is PCM?
A PCM is a polymer-filler composition that softens below the junction temperature to wet die/sink surfaces to minimize the contact resistance. It is applied between a bare flip chip die and a heat spreader, heat sink, or heat pipe and is, therefore, referred to as Thermal Interface Material (TIM) 1.5.
TIM 1 is placed between the chip or die and the integrated heat spreader, while TIM 2 is placed between the IHS and heat sink
TIM 1.5 is placed between the chip and the heat sink.
The benefits of TIM 1.5 PCM
- Applying TIM between the die and sink optimizes thermal conductivity and provides efficient heat dissipation since it reduces interface contact resistance by reducing stacking layers.
- Honeywell’s PTM series offers TIM 1.5 solutions that address the particle issue and warpage-induced change in bond-line-thickness (BLT).
- Based on a robust polymer phase change material (PCM) structure, the proprietary Honeywell material exhibits effective wetting properties during typical operating temperature ranges, resulting in low surface contact resistance.
- The material provides superior reliability and maintains low thermal impedance, making it ideal for high-performance integrated circuits.
- Honeywell's PCM is designed to handle large bare die and demonstrates excellent thermal performance on current-generation GPUs.
Test Honeywell PCMs for your applications
As you explore the benefits of TIM 1.5 PCM, we invite you to test Honeywell PCMs for your specific application needs and experience firsthand how Honeywell PCMs can address your unique thermal challenges. Our team of experts will assist you in testing and integrating our solution into your application.
Ready to Get Started? Request for a sample today.
