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Semiconductor Manufacturing 

Electronic materials for the semiconductor industry



 

 


 

Consumer Electronics   

Our Thermal Interface Materials offer cost-effective thermal filler gap pads and grease, heat transfer paste, gap filler and phase change materials to eliminate air gaps and reduce localized areas of high thermal resistance.



 

 

Phase Change Materials (PCM) are designed to minimize thermal resistance at interfaces and maintain stable performance through the rigorous reliability testing required for long product life applications.