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Thermal One-Part Hybrids

HT4500

Thermal conductivity liquid gap fillers have the benefits of shape recovery, strong material cohesion, and good long-term thermal stability — they also offer a very low thermal resistance comparable to thermal grease, and can fill gaps at interfaces.

Overview
One-Part Dispensable Very Low Compression ForceThermal conductivity liquid gap fillers not only have the benefits of shape recovery, strong material cohesion, and good long-term thermal stability — they also offer a very low thermal resistance comparable to thermal grease, and can fill gaps at interfaces. Hybrid is a substance between liquid and solid, combining the advantages of thermal grease and thermal gap pad.

Typical Applications
  • Consumer electronics 
  • Telecommunications equipment
  • Automotive electronics
  • Power supplies & semiconductors
  • Memory & power modules
  • Power electronics Features
  • High thermal performance and low contact resistance
  • Easily dispensable and reworkable
  • High compressibility for low stress applications Long-term reliability
  • No pump-out or cracking risk
  • Reduced oil separation
  • Requires no mixing, additional curing or low temperature storage
Specifications

Physical Properties

  • Color
    • Green
  • Cure Schedule
    • Pre-cured
  • Shelf Life
    • 6 months Year
  • Specific Gravity
    • 3.3, Test Method ASTM D792

Thermal Properties

  • Thermal Conductivity
    • 4.5 W/m-K, Test Method, ASTM D5470

Electrical Properties

  • Volume Resistivity
    • >1.0X1013 ohm-cm, Test Method ASTM D257

Temperature

  • Storage Temperature
    • RT

Other

  • Other Notes
    • 5 KV/mm, Test Method D149 Dielectric Strength

General Information

  • Application
    • Automation Gap Filler
  • Key Features
    • High compressibility for low stress applications
    • High thermal performance and low contact resistance
    • Long-term reliability
    • No pump-out or cracking risk
    • Reduced oil separation
  • Typical Uses
    • Consumer electronics
    • Memory & power modules
    • Power electronics
    • Power supplies
    • Telecommunications equipment

Physical Properties

  • Color
    • Green
  • Cure Schedule
    • Pre-cured
  • Shelf Life
    • 6 months Year
  • Specific Gravity
    • 3.3, Test Method ASTM D792

Thermal Properties

  • Thermal Conductivity
    • 4.5 W/m-K, Test Method, ASTM D5470

Electrical Properties

  • Volume Resistivity
    • >1.0X1013 ohm-cm, Test Method ASTM D257

Temperature

  • Storage Temperature
    • RT

Other

  • Other Notes
    • 5 KV/mm, Test Method D149 Dielectric Strength

General Information

  • Application
    • Automation Gap Filler
  • Key Features
    • High compressibility for low stress applications
    • High thermal performance and low contact resistance
    • Long-term reliability
    • No pump-out or cracking risk
    • Reduced oil separation
  • Typical Uses
    • Consumer electronics
    • Memory & power modules
    • Power electronics
    • Power supplies
    • Telecommunications equipment
  • Specific Gravity : 3.3, Test Method ASTM D792
  • Shelf Life : 6 months Year
  • Color : Green
  • Thermal Conductivity : 4.5 W/m-K, Test Method, ASTM D5470
  • Cure Schedule : Pre-cured
  • Volume Resistivity : >1.0X1013 ohm-cm, Test Method ASTM D257
  • Storage Temperature : RT
  • Other Notes : 5 KV/mm, Test Method D149 Dielectric Strength
  • Typical Uses : Consumer electronics|Memory & power modules|Power electronics|Power supplies|Telecommunications equipment
  • Key Features : High compressibility for low stress applications|High thermal performance and low contact resistance|Long-term reliability|No pump-out or cracking risk|Reduced oil separation
  • Application : Automation Gap Filler
Brochure
Name
Description
File Size
Date
Size
879055 ADM FLR TIMs LTR
application/pdf 73.46 KB
10/31/2023
73.46 KB
Thermal Interface Materials Electronics Brochure
application/pdf 820.98 KB
10/31/2023
820.98 KB
Data Sheet
Name
Description
File Size
Date
Size
HT4500 - Thermally Conductive Gap Filler
application/pdf 42.75 KB
10/31/2023
42.75 KB
Name
Description
File Size
Date
Size
HT4500 - Thermally Conductive Gap Filler
application/pdf 42.75 KB
10/31/2023
42.75 KB
879055 ADM FLR TIMs LTR
application/pdf 73.46 KB
10/31/2023
73.46 KB
Thermal Interface Materials Electronics Brochure
application/pdf 820.98 KB
10/31/2023
820.98 KB
Name
Description
File Size
Date
Size
879055 ADM FLR TIMs LTR
73.46 KB
10/31/2023
Thermal Interface Materials Electronics Brochure
820.98 KB
10/31/2023
HT4500 - Thermally Conductive Gap Filler
42.75 KB
10/31/2023