Thermal Two-Part Hybrids
HLT3500
Honeywell HLT series products are two-component cured-in-place dispensable gap fillers could be easily dispensed w/good thixotropic characteristics and low viscosity, provides the high compressibility and excellent long term reliability. (3.5 W/m·K)
Overview
Two-Part, Dispensable, Very Low Compression Force HLT series products are two-component, dispensable thermally conductive gels, which offer long-term reliability and superior softness. The enhanced bonding force between the polymer base and the filler minimizes oil separation issues in storage. Prior to curing, the material maintains good thixotropic characteristics and low viscosity to be easily dispensed.Typical Applications• Consumer electronics• Telecommunications equipment• Automotive electronics• Memory & power modulesFeatures• Low contact resistance• Easily to dispense and rework• High compressibility for low stress applications• Long-term reliability• Reduced oil separation• No pump-out and cracking
Specifications
Thermal Properties
- Thermal Conductivity
- 3.5 W/m-K, Test Method ASTM D5470
- Thermal Impedance
- 0.44 °C·in²/W, 1 mm at 10 psi, Typical Value, Test Method D5470
Physical Properties
- Viscosity
- 300000-450000 cps, Test Method ASTM D2196 (Brookfield Viscometer, #7 spindle, 10 rpm)
- Specific Gravity
- 3.2, Test Method ASTM D792
- Cure Schedule
- 12 hours at 25 °C
- 30 min at 100 °C
- Color
- Part A: White, Part B: Blue
- Shelf Life
- 6 months Year
General Information
- Key Features
- Low contact resistance
- High compressibility for low stress applications
- Long-term reliability
- Reduced oil separation
- No pump-out and cracking
- Cost effectiveness
- Easily dispensable and reworkable
- Application
- Automation Gap Filler
- Typical Uses
- Consumer electronics
- Telecommunications equipment
- Memory & power modules
- Automotive electronics
Thermal Properties
- Thermal Conductivity
- 3.5 W/m-K, Test Method ASTM D5470
- Thermal Impedance
- 0.44 °C·in²/W, 1 mm at 10 psi, Typical Value, Test Method D5470
Physical Properties
- Viscosity
- 300000-450000 cps, Test Method ASTM D2196 (Brookfield Viscometer, #7 spindle, 10 rpm)
- Specific Gravity
- 3.2, Test Method ASTM D792
- Cure Schedule
- 12 hours at 25 °C
- 30 min at 100 °C
- Color
- Part A: White, Part B: Blue
- Shelf Life
- 6 months Year
General Information
- Key Features
- Low contact resistance
- High compressibility for low stress applications
- Long-term reliability
- Reduced oil separation
- No pump-out and cracking
- Cost effectiveness
- Easily dispensable and reworkable
- Application
- Automation Gap Filler
- Typical Uses
- Consumer electronics
- Telecommunications equipment
- Memory & power modules
- Automotive electronics
- Thermal Conductivity : 3.5 W/m-K, Test Method ASTM D5470
- Thermal Impedance : 0.44 °C·in²/W, 1 mm at 10 psi, Typical Value, Test Method D5470
- Viscosity : 300000-450000 cps, Test Method ASTM D2196 (Brookfield Viscometer, #7 spindle, 10 rpm)
- Specific Gravity : 3.2, Test Method ASTM D792
- Cure Schedule : 12 hours at 25 °C|30 min at 100 °C
- Color : Part A: White, Part B: Blue
- Shelf Life : 6 months Year
- Key Features : Low contact resistance|High compressibility for low stress applications|Long-term reliability|Reduced oil separation|No pump-out and cracking|Cost effectiveness|Easily dispensable and reworkable
- Application : Automation Gap Filler
- Typical Uses : Consumer electronics|Telecommunications equipment|Memory & power modules|Automotive electronics
Others
Name
Description
File Size
Date
Size
Thermal Two-Part Hybrid: HLT2000LV - HLT3500
application/pdf 140.92 KB
11/8/2022
140.92 KB
Brochure
Name
Description
File Size
Date
Size
Thermal Interface Materials Electronics Brochure
application/pdf 819.47 KB
11/8/2022
819.47 KB
Name
Description
File Size
Date
Size
Thermal Two-Part Hybrid: HLT2000LV - HLT3500
140.92 KB
11/8/2022
140.92 KB
Thermal Interface Materials Electronics Brochure
819.47 KB
11/8/2022
819.47 KB
Name
Description
File Size
Date
Size
Thermal Two-Part Hybrid: HLT2000LV - HLT3500
140.92 KB
11/8/2022
Thermal Interface Materials Electronics Brochure
819.47 KB
11/8/2022
