Thermal Two-Part Hybrids
HLT2000LV
Honeywell HLT series are two-component cured-in-place dispensable gap fillers that could be easily dispensed w/good thixotropic characteristics & low viscosity, provides high compressibility & excellent long term reliability.(2.0 W/m·K,low volatile)
Overview
Two-Part, Dispensable, Very Low Compression Force HLT series products are two-component, dispensable thermally conductive gels, which offer long-term reliability and superior softness. The enhanced bonding force between the polymer base and the filler minimizes oil separation issues in storage. Prior to curing, the material maintains good thixotropic characteristics and low viscosity to be easily dispensed.Typical Applications• Consumer electronics• Telecommunications equipment• Automotive electronics• Memory & power modulesFeatures• Low contact resistance• Easily to dispense and rework• High compressibility for low stress applications• Long-term reliability• Reduced oil separation• No pump-out and cracking
Specifications
Physical Properties
- Color
- Part A: White, Part B: Dark Red
- Specific Gravity
- 2.8, Test Method ASTM D792
Thermal Properties
- Thermal Conductivity
- 2.0 W/m-K, Test Method ASTM D5470
- Thermal Impedance
- 0.60 °C·in²/W, 1 mm at 10 psi, Typical Value, Test Method D5470
General Information
- Application
- Automation Gap Filler
Physical Properties
- Color
- Part A: White, Part B: Dark Red
- Specific Gravity
- 2.8, Test Method ASTM D792
Thermal Properties
- Thermal Conductivity
- 2.0 W/m-K, Test Method ASTM D5470
- Thermal Impedance
- 0.60 °C·in²/W, 1 mm at 10 psi, Typical Value, Test Method D5470
General Information
- Application
- Automation Gap Filler
- Color : Part A: White, Part B: Dark Red
- Thermal Impedance : 0.60 °C·in²/W, 1 mm at 10 psi, Typical Value, Test Method D5470
- Specific Gravity : 2.8, Test Method ASTM D792
- Thermal Conductivity : 2.0 W/m-K, Test Method ASTM D5470
- Application : Automation Gap Filler
Others
Name
Description
File Size
Date
Size
Thermal Two-Part Hybrid: HLT2000LV - HLT3500
application/pdf 126.73 KB
10/31/2023
126.73 KB
Brochure
Name
Description
File Size
Date
Size
Thermal Interface Materials Electronics Brochure
application/pdf 820.98 KB
10/31/2023
820.98 KB
Name
Description
File Size
Date
Size
Thermal Interface Materials Electronics Brochure
820.98 KB
10/31/2023
820.98 KB
Thermal Two-Part Hybrid: HLT2000LV - HLT3500
126.73 KB
10/31/2023
126.73 KB
Name
Description
File Size
Date
Size
Thermal Two-Part Hybrid: HLT2000LV - HLT3500
126.73 KB
10/31/2023
Thermal Interface Materials Electronics Brochure
820.98 KB
10/31/2023
