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Thermal Grease

TG3000I

Honeywell silicone grease products provide superior thermal performance w/ease of use across many applications. Provides low viscosity & inherent thixotropy for large-scale production w/dispensing and screen and stencil printing.(3.0 W/m·K, BLT 10µm)

Overview
High Thermal Conductivity Honeywell silicone grease products provide superior thermal performance with ease of use across a multitude of applications. The low viscosity and inherent thixotropy make the technology a good fit for large-scale production with dispensing, screen printing and stencil printing. Thermal Grease is a common silicone thermal interface material, usually used to increase thermal contact conductance across jointed solid surfaces. Thermal interface materials occupy the space of air (a very poor thermal conductor) and fill in the gaps between two solid surfaces. This establishes an effective thermal path between a heat-generating component and a heat sink attached to it, greatly increasing thermal transfer efficiency.Typical Applications• CPU, GPU and chipsets• LED assemblies• Automotive electronics• IGBT & power units• Flipchip BGAs• Range of thermal properties to fit different needsFeatures• Low viscosity and excellent thixotropy for dispensing or stencil/screen printing• Range of BLT thicknesses• Thermal resistance and thermal conductivity options for different power densities• High stability and reliability• Stable and homogeneous at room temperature storage• Range of thermal properties to fit different needs
Specifications

Physical Properties

  • Bond-Line Thickness (BLT)
    • 10 µm at 35 psi, 50 °C, Test Method HON Internal
  • Color
    • White
  • Shelf Life
    • 12 months Year
  • Specific Gravity
    • 3.4, Test Method ASTM D792
  • Viscosity
    • 200000 cps at 25 °C, Test Method Brookfield Viscometer

Thermal Properties

  • Thermal Conductivity
    • 3.0 W/m-K, Test Method Hot Disk
  • Thermal Impedance
    • 0.003 °C·in²/W, 35 psi, 50 °C, Test Method ASTM D5470

Electrical Properties

  • Dielectric Constant
    • >10 at 1MHz, Test Method ASTM D150
  • Volume Resistivity
    • 2.0x1012 ohm-cm, Test Method ASTM D257

Flammability Properties

  • Flammability
    • V-0, Test Method UL94
  • Working Temperature
    • -40-150 °C

Temperature

  • Storage Temperature
    • Room Temperature

General Information

  • Application
    • Thin Bondline
  • Key Features
    • Cost effectiveness
    • Electrical isolation
  • Typical Uses
    • Flipchip BGAs
    • IGBT & power units
    • LED assemblies

Physical Properties

  • Bond-Line Thickness (BLT)
    • 10 µm at 35 psi, 50 °C, Test Method HON Internal
  • Color
    • White
  • Shelf Life
    • 12 months Year
  • Specific Gravity
    • 3.4, Test Method ASTM D792
  • Viscosity
    • 200000 cps at 25 °C, Test Method Brookfield Viscometer

Thermal Properties

  • Thermal Conductivity
    • 3.0 W/m-K, Test Method Hot Disk
  • Thermal Impedance
    • 0.003 °C·in²/W, 35 psi, 50 °C, Test Method ASTM D5470

Electrical Properties

  • Dielectric Constant
    • >10 at 1MHz, Test Method ASTM D150
  • Volume Resistivity
    • 2.0x1012 ohm-cm, Test Method ASTM D257

Flammability Properties

  • Flammability
    • V-0, Test Method UL94
  • Working Temperature
    • -40-150 °C

Temperature

  • Storage Temperature
    • Room Temperature

General Information

  • Application
    • Thin Bondline
  • Key Features
    • Cost effectiveness
    • Electrical isolation
  • Typical Uses
    • Flipchip BGAs
    • IGBT & power units
    • LED assemblies
  • Color : White
  • Bond-Line Thickness (BLT) : 10 µm at 35 psi, 50 °C, Test Method HON Internal
  • Thermal Conductivity : 3.0 W/m-K, Test Method Hot Disk
  • Thermal Impedance : 0.003 °C·in²/W, 35 psi, 50 °C, Test Method ASTM D5470
  • Specific Gravity : 3.4, Test Method ASTM D792
  • Shelf Life : 12 months Year
  • Viscosity : 200000 cps at 25 °C, Test Method Brookfield Viscometer
  • Dielectric Constant : >10 at 1MHz, Test Method ASTM D150
  • Volume Resistivity : 2.0x1012 ohm-cm, Test Method ASTM D257
  • Flammability : V-0, Test Method UL94
  • Working Temperature : -40-150 °C
  • Storage Temperature : Room Temperature
  • Typical Uses : Flipchip BGAs|IGBT & power units|LED assemblies
  • Key Features : Cost effectiveness|Electrical isolation
  • Application : Thin Bondline
Brochure
Name
Description
File Size
Date
Size
Thermal Interface Materials Electronics Brochure
application/pdf 820.98 KB
10/31/2023
820.98 KB
879055 ADM FLR TIMs LTR
application/pdf 73.46 KB
10/31/2023
73.46 KB
Data Sheet
Name
Description
File Size
Date
Size
Thermal Grease: TG2000I - TG5500
application/pdf 220.31 KB
10/31/2023
220.31 KB
Name
Description
File Size
Date
Size
Thermal Grease: TG2000I - TG5500
220.31 KB
10/31/2023
220.31 KB
Thermal Interface Materials Electronics Brochure
820.98 KB
10/31/2023
820.98 KB
879055 ADM FLR TIMs LTR
73.46 KB
10/31/2023
73.46 KB
Name
Description
File Size
Date
Size
Thermal Interface Materials Electronics Brochure
820.98 KB
10/31/2023
879055 ADM FLR TIMs LTR
73.46 KB
10/31/2023
Thermal Grease: TG2000I - TG5500
220.31 KB
10/31/2023