Outage Notification: This website will undergo a planned maintenance outage on Saturday, June 5, from 12:30-2:30 p.m. EDT (6:30-8:30 p.m. UDT). We regret any inconvenience this may cause.

Thermal Gap Filler Pads

TGP6000

Excellent surface wetting designed for low contact resistance. Naturally tacky, and requires no additional adhesive which could inhibit thermal performance. (Grey color, 0.25 Thermal Impedance, 6.0 Thermal Conductivity, Hardness 40 on Shore 00)

Honeywell Thermal Gap Filler Pads (TGPs) provide high thermal performance with ease of use for many applications. Ultra-high compressibility enables low stress and excellent conformity to mating surfaces. Honeywell TGP models are naturally tacky, and require no additional adhesive which could inhibit thermal performance. TGP models have been designed to minimize thermal resistance at interfaces, and maintain effective performance through reliability testing. TGP models are silicone based, therefore they offer a certain anti-shock effect, with electrical isolation and non-flammability.Typical Applications• Consumer electronics• Telecommunications & network servers• Automotive electronics• Power devices & modules• Semiconductor logic & memoryFeatures• High thermal performance• Ultra-high compressibility for low stress applications• Excellent surface wetting for low contact resistance• High reliability• Electrically insulating

Thermal Properties

  • Thermal Conductivity
    • 6.0 W/m-K, Test Method ASTM D5470
  • Thermal Impedance
    • 0.25 °C·in²/W, 1 mm at 10 psi, Typical Value, Test Method ASTM D5470

Physical Properties

  • Hardness
    • 40 Shore00, Test Method ASTM D2240
  • Specific Gravity
    • 3.3, Test Method ASTM D792
  • Color
    • Grey
  • Thickness mm
    • 0.5-5, Test Method ASTM D374
  • Shelf Life
    • 12 months

Electrical Properties

  • Dielectric Constant
    • 8.5 at 1MHz, Test Method ASTM D150
  • Volume Resistivity
    • 3.79x1015 ohm-cm, Test Method ASTM D257

Flammability Properties

  • Flammability
    • V-0, Test Method UL94

General Information

  • Key Features
    • Low Oil Bleeding
  • Application
    • High Compressibility

Thermal Properties

  • Thermal Conductivity
    • 6.0 W/m-K, Test Method ASTM D5470
  • Thermal Impedance
    • 0.25 °C·in²/W, 1 mm at 10 psi, Typical Value, Test Method ASTM D5470

Physical Properties

  • Hardness
    • 40 Shore00, Test Method ASTM D2240
  • Specific Gravity
    • 3.3, Test Method ASTM D792
  • Color
    • Grey
  • Thickness mm
    • 0.5-5, Test Method ASTM D374
  • Shelf Life
    • 12 months

Electrical Properties

  • Dielectric Constant
    • 8.5 at 1MHz, Test Method ASTM D150
  • Volume Resistivity
    • 3.79x1015 ohm-cm, Test Method ASTM D257

Flammability Properties

  • Flammability
    • V-0, Test Method UL94

General Information

  • Key Features
    • Low Oil Bleeding
  • Application
    • High Compressibility
  • Thermal Conductivity : 6.0 W/m-K, Test Method ASTM D5470
  • Hardness : 40 Shore00, Test Method ASTM D2240
  • Specific Gravity : 3.3, Test Method ASTM D792
  • Color : Grey
  • Thickness mm : 0.5-5, Test Method ASTM D374
  • Thermal Impedance : 0.25 °C·in²/W, 1 mm at 10 psi, Typical Value, Test Method ASTM D5470
  • Shelf Life : 12 months
  • Dielectric Constant : 8.5 at 1MHz, Test Method ASTM D150
  • Flammability : V-0, Test Method UL94
  • Volume Resistivity : 3.79x1015 ohm-cm, Test Method ASTM D257
  • Key Features : Low Oil Bleeding
  • Application : High Compressibility
Brochure
Name
Description
File Size
Date
Size
Thermal Gap Filler Pads
application/pdf 52.38 KB
9/3/2021
52.38 KB
879055 ADM FLR TIMs LTR
application/pdf 73.66 KB
9/7/2022
73.66 KB
Thermal Interface Materials Electronics Brochure
application/pdf 819.47 KB
9/7/2022
819.47 KB
Thermal Gap Filler Pads
application/pdf 52.38 KB
9/14/2022
52.38 KB
Thermal Interface Materials Electronics Brochure
application/pdf 819.47 KB
9/14/2022
819.47 KB
879055 ADM FLR TIMs LTR
application/pdf 73.66 KB
9/14/2022
73.66 KB
879055 ADM FLR TIMs LTR
application/pdf 73.66 KB
11/8/2022
73.66 KB
Thermal Interface Materials Electronics Brochure
application/pdf 819.47 KB
11/8/2022
819.47 KB
Thermal Gap Filler Pads
application/pdf 52.38 KB
11/8/2022
52.38 KB
Name
Description
File Size
Date
Size
Thermal Gap Filler Pads
52.38 KB
9/3/2021
52.38 KB
879055 ADM FLR TIMs LTR
73.66 KB
9/7/2022
73.66 KB
Thermal Interface Materials Electronics Brochure
819.47 KB
9/7/2022
819.47 KB
Thermal Gap Filler Pads
52.38 KB
9/14/2022
52.38 KB
Thermal Interface Materials Electronics Brochure
819.47 KB
9/14/2022
819.47 KB
879055 ADM FLR TIMs LTR
73.66 KB
9/14/2022
73.66 KB
879055 ADM FLR TIMs LTR
73.66 KB
11/8/2022
73.66 KB
Thermal Interface Materials Electronics Brochure
819.47 KB
11/8/2022
819.47 KB
Thermal Gap Filler Pads
52.38 KB
11/8/2022
52.38 KB
Name
Description
File Size
Date
Size
Thermal Gap Filler Pads
52.38 KB
9/3/2021
879055 ADM FLR TIMs LTR
73.66 KB
9/7/2022
Thermal Interface Materials Electronics Brochure
819.47 KB
9/7/2022
Thermal Gap Filler Pads
52.38 KB
9/14/2022
Thermal Interface Materials Electronics Brochure
819.47 KB
9/14/2022
879055 ADM FLR TIMs LTR
73.66 KB
9/14/2022
879055 ADM FLR TIMs LTR
73.66 KB
11/8/2022
Thermal Interface Materials Electronics Brochure
819.47 KB
11/8/2022
Thermal Gap Filler Pads
52.38 KB
11/8/2022