Sputtering Targets and Coil Sets
Copper (Cu) Target
Honeywell Electronic Materials’ internal refining, casting, and manufacturing capabilities deliver clean and consistent 6N (99.9999%) purity Copper (Cu) sputtering
Overview
Sales Sheet
Name
Description
File Size
Date
Size
Various metals and configurations
application/pdf 315.97 KB
10/31/2023
315.97 KB
Metals for underbump metallurgy (UBM) and wafer bumping (WB)
application/pdf 1.24 MB
1/25/2024
1.24 MB
Name
Description
File Size
Date
Size
Various metals and configurations
315.97 KB
10/31/2023
315.97 KB
Metals for underbump metallurgy (UBM) and wafer bumping (WB)
1.24 MB
1/25/2024
1.24 MB
Name
Description
File Size
Date
Size
Metals for underbump metallurgy (UBM) and wafer bumping (WB)
1.24 MB
1/25/2024
