High Purity Evaporation Materials
Silver (Ag)
Overview
Sales Sheet
Name
Description
File Size
Date
Size
Metals for dieback metallization and underbump metallurgy (UBM) for flip chip applications
application/pdf 525.61 KB
9/7/2022
525.61 KB
Name
Description
File Size
Date
Size
Metals for dieback metallization and underbump metallurgy (UBM) for flip chip applications
525.61 KB
9/7/2022
525.61 KB
Name
Description
File Size
Date
Size
Metals for dieback metallization and underbump metallurgy (UBM) for flip chip applications
525.61 KB
9/7/2022
