High Purity Evaporation Materials
Gold (Au)
Au
Overview
Sales Sheet
Name
Description
File Size
Date
Size
Metals for dieback metallization and underbump metallurgy (UBM) for flip chip applications
application/pdf 525.4 KB
10/31/2023
525.4 KB
Name
Description
File Size
Date
Size
Metals for dieback metallization and underbump metallurgy (UBM) for flip chip applications
525.4 KB
10/31/2023
525.4 KB
Name
Description
File Size
Date
Size
Metals for dieback metallization and underbump metallurgy (UBM) for flip chip applications
525.4 KB
10/31/2023
