High Purity Evaporation Materials
Au 2Si, Au 3.1Si
Au 2Si, Au 3.1Si
Overview
Sales Sheet
Name
Description
File Size
Date
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Metals for dieback metallization and underbump metallurgy (UBM) for flip chip applications
application/pdf 525.4 KB
10/31/2023
525.4 KB
Name
Description
File Size
Date
Size
Metals for dieback metallization and underbump metallurgy (UBM) for flip chip applications
525.4 KB
10/31/2023
525.4 KB
Name
Description
File Size
Date
Size
Metals for dieback metallization and underbump metallurgy (UBM) for flip chip applications
525.4 KB
10/31/2023
