High Purity Evaporation Materials
Aluminum (Al)
Evaporation slug
Overview
Sales Sheet
Name
Description
File Size
Date
Size
Metals for dieback metallization and underbump metallurgy (UBM) for flip chip applications
application/pdf 525.4 KB
10/31/2023
525.4 KB
Metals for underbump metallurgy (UBM) and wafer bumping (WB)
application/pdf 1.24 MB
1/25/2024
1.24 MB
Name
Description
File Size
Date
Size
Metals for dieback metallization and underbump metallurgy (UBM) for flip chip applications
525.4 KB
10/31/2023
525.4 KB
Metals for underbump metallurgy (UBM) and wafer bumping (WB)
1.24 MB
1/25/2024
1.24 MB
Name
Description
File Size
Date
Size
Metals for dieback metallization and underbump metallurgy (UBM) for flip chip applications
525.4 KB
10/31/2023
Metals for underbump metallurgy (UBM) and wafer bumping (WB)
1.24 MB
1/25/2024
