Honeywell Plating Anodes, backed by our robust supply chain and metrology capabilities, provide consistency and reliability in performance.

Continued growth in flip chip packaging points toward the increased adoption of electroplating for wafer bumping applications.  Honeywell is uniquely positioned to provide Sn- and Cu-based Plating Anodes for use in wafer bumping.

Honeywell RadLo Plating Anodes offer the following features:

  • Available in various low alpha grades
  • High purity (>99.99% pure)
  • Precision machined
  • Class 1000 cleanroom packaging


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