Continued growth in flip chip packaging points toward the increased adoption of electroplating for wafer bumping applications. Honeywell is uniquely positioned to provide Sn- and Cu-based Plating Anodes for use in wafer bumping.
Honeywell RadLo Plating Anodes offer the following features:
- Available in various low alpha grades
- High purity (>99.99% pure)
- Precision machined
- Class 1000 cleanroom packaging
Start your search with category name, product name, part number, etc.
Maximum File Size
Maximum Files Exceeded
Honeywell International Inc. is committed to ensuring compliance with global laws that regulate its export and import activities. In following company procedures, it has been determined that is identified on a denied/restricted parties list that is applicable to this transaction.
As a result, Honeywell is unable to continue with this request.