false
false
false
Thermal Two-Part Hybrids
HLT3500
Honeywell HLT series products are two-component cured-in-place dispensable gap fillers could be easily dispensed w/good thixotropic characteristics and low viscosity, provides the high compressibility and excellent long term reliability. (3.5 W/m·K)
Please sign in to access more documents
Once signed in, you may be able to access additional documents for your account.
Overview
Two-Part, Dispensable, Very Low Compression Force HLT series products are two-component, dispensable thermally conductive gels, which offer long-term reliability and superior softness. The enhanced bonding force between the polymer base and the filler minimizes oil separation issues in storage. Prior to curing, the material maintains good thixotropic characteristics and low viscosity to be easily dispensed.Typical Applications• Consumer electronics• Telecommunications equipment• Automotive electronics• Memory & power modulesFeatures• Low contact resistance• Easily to dispense and rework• High compressibility for low stress applications• Long-term reliability• Reduced oil separation• No pump-out and cracking
Specifications
Physical Properties
- Color
- Part A: White, Part B: Blue
- Cure Schedule
- 12 hours at 25 °C
- 30 min at 100 °C
- Shelf Life
- 6 months Year
- Specific Gravity
- 3.2, Test Method ASTM D792
- Viscosity
- 300000-450000 cps, Test Method ASTM D2196 (Brookfield Viscometer, #7 spindle, 10 rpm)
Thermal Properties
- Thermal Conductivity
- 3.5 W/m-K, Test Method ASTM D5470
- Thermal Impedance
- 0.44 °C·in²/W, 1 mm at 10 psi, Typical Value, Test Method D5470
General Information
- Application
- Automation Gap Filler
- Key Features
- High compressibility for low stress applications
- Long-term reliability
- Low contact resistance
- No pump-out and cracking
- Reduced oil separation
- Typical Uses
- Consumer electronics
- Memory & power modules
- Telecommunications equipment
Physical Properties
- Color
- Part A: White, Part B: Blue
- Cure Schedule
- 12 hours at 25 °C
- 30 min at 100 °C
- Shelf Life
- 6 months Year
- Specific Gravity
- 3.2, Test Method ASTM D792
- Viscosity
- 300000-450000 cps, Test Method ASTM D2196 (Brookfield Viscometer, #7 spindle, 10 rpm)
Thermal Properties
- Thermal Conductivity
- 3.5 W/m-K, Test Method ASTM D5470
- Thermal Impedance
- 0.44 °C·in²/W, 1 mm at 10 psi, Typical Value, Test Method D5470
General Information
- Application
- Automation Gap Filler
- Key Features
- High compressibility for low stress applications
- Long-term reliability
- Low contact resistance
- No pump-out and cracking
- Reduced oil separation
- Typical Uses
- Consumer electronics
- Memory & power modules
- Telecommunications equipment
- Specific Gravity : 3.2, Test Method ASTM D792
- Shelf Life : 6 months Year
- Thermal Impedance : 0.44 °C·in²/W, 1 mm at 10 psi, Typical Value, Test Method D5470
- Viscosity : 300000-450000 cps, Test Method ASTM D2196 (Brookfield Viscometer, #7 spindle, 10 rpm)
- Cure Schedule : 12 hours at 25 °C|30 min at 100 °C
- Thermal Conductivity : 3.5 W/m-K, Test Method ASTM D5470
- Color : Part A: White, Part B: Blue
- Key Features : High compressibility for low stress applications|Long-term reliability|Low contact resistance|No pump-out and cracking|Reduced oil separation
- Application : Automation Gap Filler
- Typical Uses : Consumer electronics|Memory & power modules|Telecommunications equipment
Others
Name
Description
File Size
Date
Size
Thermal Two-Part Hybrid: HLT2000LV - HLT3500
application/pdf 126.73 KB
10/31/2023
126.73 KB
Brochure
Name
Description
File Size
Date
Size
Thermal Interface Materials Electronics Brochure
application/pdf 820.98 KB
10/31/2023
820.98 KB
Name
Description
File Size
Date
Size
Thermal Two-Part Hybrid: HLT2000LV - HLT3500
application/pdf 126.73 KB
10/31/2023
126.73 KB
Thermal Interface Materials Electronics Brochure
application/pdf 820.98 KB
10/31/2023
820.98 KB
Name
Description
File Size
Date
Size
Thermal Two-Part Hybrid: HLT2000LV - HLT3500
126.73 KB
10/31/2023
Thermal Interface Materials Electronics Brochure
820.98 KB
10/31/2023