Thermal Two-Part Hybrids
HLT3500
Honeywell HLT series products are two-component cured-in-place dispensable gap fillers could be easily dispensed w/good thixotropic characteristics and low viscosity, provides the high compressibility and excellent long term reliability. (3.5 W/m·K)
Please sign in to access more documents
Once signed in, you may be able to access additional documents for your account.
Physical Properties
- Color
- Part A: White, Part B: Blue
- Cure Schedule
- 12 hours at 25 °C
- 30 min at 100 °C
- Shelf Life
- 6 months Year
- Specific Gravity
- 3.2, Test Method ASTM D792
- Viscosity
- 300000-450000 cps, Test Method ASTM D2196 (Brookfield Viscometer, #7 spindle, 10 rpm)
Thermal Properties
- Thermal Conductivity
- 3.5 W/m-K, Test Method ASTM D5470
- Thermal Impedance
- 0.44 °C·in²/W, 1 mm at 10 psi, Typical Value, Test Method D5470
General Information
- Application
- Automation Gap Filler
- Key Features
- High compressibility for low stress applications
- Long-term reliability
- Low contact resistance
- No pump-out and cracking
- Reduced oil separation
- Typical Uses
- Consumer electronics
- Memory & power modules
- Telecommunications equipment
Physical Properties
- Color
- Part A: White, Part B: Blue
- Cure Schedule
- 12 hours at 25 °C
- 30 min at 100 °C
- Shelf Life
- 6 months Year
- Specific Gravity
- 3.2, Test Method ASTM D792
- Viscosity
- 300000-450000 cps, Test Method ASTM D2196 (Brookfield Viscometer, #7 spindle, 10 rpm)
Thermal Properties
- Thermal Conductivity
- 3.5 W/m-K, Test Method ASTM D5470
- Thermal Impedance
- 0.44 °C·in²/W, 1 mm at 10 psi, Typical Value, Test Method D5470
General Information
- Application
- Automation Gap Filler
- Key Features
- High compressibility for low stress applications
- Long-term reliability
- Low contact resistance
- No pump-out and cracking
- Reduced oil separation
- Typical Uses
- Consumer electronics
- Memory & power modules
- Telecommunications equipment
- Specific Gravity : 3.2, Test Method ASTM D792
- Shelf Life : 6 months Year
- Thermal Impedance : 0.44 °C·in²/W, 1 mm at 10 psi, Typical Value, Test Method D5470
- Viscosity : 300000-450000 cps, Test Method ASTM D2196 (Brookfield Viscometer, #7 spindle, 10 rpm)
- Cure Schedule : 12 hours at 25 °C|30 min at 100 °C
- Thermal Conductivity : 3.5 W/m-K, Test Method ASTM D5470
- Color : Part A: White, Part B: Blue
- Key Features : High compressibility for low stress applications|Long-term reliability|Low contact resistance|No pump-out and cracking|Reduced oil separation
- Application : Automation Gap Filler
- Typical Uses : Consumer electronics|Memory & power modules|Telecommunications equipment