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ADVANCED MATERIALS
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Electronic Materials
Providing critical materials that enhance the performance and productivity of your electronics manufacturing processes.
For over 20 years, Honeywell has been delivering a wide range of innovative products serving the critical needs of manufacturers in the electronics industry. We do this through continuous investment in advanced research, worldwide strategic collaborations, and dedication to working closely with our customer. We are committed to quality and continue to evolve our quality disciplines to ensure that we exceed customer requirements.
We’re located in multiple manufacturing and research and development sites across the United States, Europe and Asia. In addition, we hold nearly 400 granted and pending patents.
Featured Applications
Fabrication
Semiconductor fabrication involves the manufacturing process of semiconductor devices, such as integrated circuits (ICs) and microchips, which are fundamental components of modern electronics. This highly intricate process entails the precise deposition, patterning, and etching of various materials on semiconductor substrates.
Targets
High purity physical vapor deposition technique (PVD) sputtering targets and coil sets such as Aluminum (Al) alloys, Copper (Cu), Copper (Cu) alloys, Tantalum (Ta), Titanium (Ti), Tungsten (W).
Anti-Reflective Coatings (ARC), Gap Fills & Dielectrics
Thermocouples
Honeywell Electronic Materials offers a unique program for thermocouple management. The Honeywell SWAP program makes it easier to do business with by streamlining thermocouple management.
Etchants
Etchant blends selectively and uniformly remove substrates without damaging underlying layers, critical to wafer manufacturing. Our blending expertise ranges from mainstream etchants to unique blends for customer-specific applications.
Electronic Chemicals
Explore the broadest range of ultra-high purity (UHP) chemistries for electronics and semiconductors. Meticulous quality controls ensure supply reliability and superior performance. Our flexible, streamlined facilities can tailor your application-specific products with customizable package sizes, volumes, substrates, and designs.
Packaging & Assembly
Our Thermal Interface Materials offer cost-effective thermal filler gap pads and grease, heat transfer paste, gap filler and phase change materials to eliminate air gaps and reduce localized areas of high thermal resistance.
Heat Spreaders
Honeywell’s Heat Spreaders are designed to meet the critical needs of electronics industry
Thermal Interface Materials (TIMs)
Thermal interface materials (TIMs) are widely employed to manufacture the most critical parts in the heat dissipation system, to cool and protect integrated circuit (IC) chips. Honeywell TIMs are based on proprietary technologies of polymer matrices and thermally conductive fillers, enabling them to handle challenging heat dissipation issues with long-term reliability and low cost of ownership. TIMs portfolio is designed to meet the critical needs of electronics industry.
Low Alpha Materials
Low alpha packaging solutions are critical for reliable production of high-performance semiconductor devices. Honeywell RadLo™ materials include solder material of various low alpha grades for devices challenged by soft errors.
Products
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