Thermal Gap Filler Pads
TGP5000
Very good elastic modulus. Naturally tacky, requiring no additional adhesive which could inhibit thermal performance. Available thickness from 0.5 to 5 mm. (Blue color, 0.3 Thermal Impedance, 5.0 Thermal Conductivity, Hardness 45 on Shore 00)
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Physical Properties
- Color
- Blue
- Hardness
- 45 Shore00, Test Method ASTM D2240
- Shelf Life
- 12 months Year
- Specific Gravity
- 3.3, Test Method ASTM D792
- Thickness (mm)
- 0.5-5, Test Method ASTM D374
Thermal Properties
- Thermal Conductivity
- 5.0 W/m-K, Test Method ASTM D5470
- Thermal Impedance
- 0.30 °C·in²/W, 1 mm at 10 psi, Typical Value, Test Method ASTM D5470
Electrical Properties
- Dielectric Constant
- 5.0 at 1MHz, Test Method ASTM D150
- Volume Resistivity
- 8.0x1013 ohm-cm, Test Method ASTM D257
Flammability Properties
- Flammability
- V-0, Test Method UL94
General Information
- Application
- High Compressibility
- Key Features
- Low Hardness
- Typical Uses
- Consumer electronics
- Power devices & modules
- Semiconductor logic & memory
- Telecommunications & network servers
Physical Properties
- Color
- Blue
- Hardness
- 45 Shore00, Test Method ASTM D2240
- Shelf Life
- 12 months Year
- Specific Gravity
- 3.3, Test Method ASTM D792
- Thickness (mm)
- 0.5-5, Test Method ASTM D374
Thermal Properties
- Thermal Conductivity
- 5.0 W/m-K, Test Method ASTM D5470
- Thermal Impedance
- 0.30 °C·in²/W, 1 mm at 10 psi, Typical Value, Test Method ASTM D5470
Electrical Properties
- Dielectric Constant
- 5.0 at 1MHz, Test Method ASTM D150
- Volume Resistivity
- 8.0x1013 ohm-cm, Test Method ASTM D257
Flammability Properties
- Flammability
- V-0, Test Method UL94
General Information
- Application
- High Compressibility
- Key Features
- Low Hardness
- Typical Uses
- Consumer electronics
- Power devices & modules
- Semiconductor logic & memory
- Telecommunications & network servers
- Thickness (mm) : 0.5-5, Test Method ASTM D374
- Specific Gravity : 3.3, Test Method ASTM D792
- Shelf Life : 12 months Year
- Color : Blue
- Thermal Impedance : 0.30 °C·in²/W, 1 mm at 10 psi, Typical Value, Test Method ASTM D5470
- Thermal Conductivity : 5.0 W/m-K, Test Method ASTM D5470
- Hardness : 45 Shore00, Test Method ASTM D2240
- Dielectric Constant : 5.0 at 1MHz, Test Method ASTM D150
- Volume Resistivity : 8.0x1013 ohm-cm, Test Method ASTM D257
- Flammability : V-0, Test Method UL94
- Application : High Compressibility
- Key Features : Low Hardness
- Typical Uses : Consumer electronics|Power devices & modules|Semiconductor logic & memory|Telecommunications & network servers