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Phase Change Materials
PTM7900-SP
PTM7900-SP is a Phase Change Paste with a Thermal Impedance of 0.04 - 0.08 (OC cm2/w), Thermal Conductivity of 8 (w/mk) and Specific Gravity of 2.5 (g/cm3). Its drying time is 24 hours at room temperature and under 5 minutes at 100oC
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Overview
PTM7900-SP is designed to minimize thermal resistance at interfaces and maintain extremely stable performance through reliability testing for long product life applications. It has stable thermal impedance across accelerated aging tests and does not display bleeding, pumping, or flow out.PTM7900 has a Thermal conductivity of 8.0 (W/m·K) depending on the bondline thickness. It is based on a robust polymer PCM structure that exhibits excellent wetting properties during typical operating temperature ranges, resulting in very low surface contact resistance. This proprietary material provides superior reliability and maintains low thermal impedance (0.04 - 0.08 OC cm2/w), making it desirable for high-performance integrated circuit devices. It has been qualified by major GPU and cooling solution manufacturers across the globe.
Specifications
Physical Properties
- Specific Gravity
- 2.5
- Viscosity
- 177
- Drying Type
- Fast
- Format
- Paste/Printable
Thermal Properties
- Thermal Conductivity
- 8
- Thermal Impedance
- 0.04-0.08
General Information
- Application
- Notebook/Tablet/PC
- Projector
- Industry
- Consumer electronics
Physical Properties
- Specific Gravity
- 2.5
- Viscosity
- 177
- Drying Type
- Fast
- Format
- Paste/Printable
Thermal Properties
- Thermal Conductivity
- 8
- Thermal Impedance
- 0.04-0.08
General Information
- Application
- Notebook/Tablet/PC
- Projector
- Industry
- Consumer electronics
- Specific Gravity : 2.5
- Thermal Conductivity : 8
- Thermal Impedance : 0.04-0.08
- Viscosity : 177
- Industry : Consumer electronics
- Application : Notebook/Tablet/PC|Projector
- Drying Type : Fast
- Format : Paste/Printable