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Phase Change Materials
PTM6000-SP
PTM6000-SP is a Phase Change Paste with a Thermal Impedance of 0.06 - 0.08 (OC cm2/w), Thermal Conductivity of 4.4 (w/mk) and Specific Gravity of 2 (g/cm3)
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Overview
PTM6000-SP is designed to minimize thermal resistance at interfaces and maintain extremely stable performance through reliability testing required for long product life applications. Like all phase change materials, it has stable thermal impedance across accelerated aging tests and does not display bleeding, pumping, or flow out. It can withstand temperatures up to 150°C.PTM6000-SP has a Thermal conductivity of 4.4 (W/m·K) depending on the bondline thickness. It is based on a robust polymer PCM structure that exhibits excellent wetting properties during typical operating temperature ranges, resulting in very low surface contact resistance. The proprietary material provides superior reliability and maintains low thermal impedance (0.06-0.08), making it desirable for high-performance integrated circuit devices.
Specifications
Physical Properties
- Specific Gravity
- 2
- Format
- Paste/Printable
- Drying Type
- Fast
Thermal Properties
- Thermal Impedance
- 0.06-0.08
General Information
- Application
- High Reliability
Physical Properties
- Specific Gravity
- 2
- Format
- Paste/Printable
- Drying Type
- Fast
Thermal Properties
- Thermal Impedance
- 0.06-0.08
General Information
- Application
- High Reliability
- Specific Gravity : 2
- Thermal Impedance : 0.06-0.08
- Application : High Reliability
- Format : Paste/Printable
- Drying Type : Fast