Thermal Two-Part Hybrids
HLT2000
Honeywell HLT series products are two-component cured-in-place dispensable gap fillers could be easily dispensed w/good thixotropic characteristics and low viscosity, provides the high compressibility and excellent long term reliability. (2.0 W/m·K)
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Overview
Two-Part, Dispensable, Very Low Compression Force HLT series products are two-component, dispensable thermally conductive gels, which offer long-term reliability and superior softness. The enhanced bonding force between the polymer base and the filler minimizes oil separation issues in storage. Prior to curing, the material maintains good thixotropic characteristics and low viscosity to be easily dispensed.
Typical Applications
• Consumer electronics
• Telecommunications equipment
• Automotive electronics
• Memory & power modules
Features
• Low contact resistance
• Easily to dispense and rework
• High compressibility for low stress applications
• Long-term reliability
• Reduced oil separation
• No pump-out and cracking
Typical Applications
• Consumer electronics
• Telecommunications equipment
• Automotive electronics
• Memory & power modules
Features
• Low contact resistance
• Easily to dispense and rework
• High compressibility for low stress applications
• Long-term reliability
• Reduced oil separation
• No pump-out and cracking
Specifications
Physical Properties
- Color
- Part A: Yellow
- Part B: White
- Cure Schedule
- 10 hours at 25 °C
- 30 min at 100 °C
- Hardness
- 50 Shore00, Test Method ASTM D2240
- Shelf Life
- 6 months Year
- Specific Gravity
- 2.8, Test Method ASTM D792
- Viscosity
- 200000-350000 cps, Test Method ASTM D2196
- Format
- Gel
Thermal Properties
- Thermal Conductivity
- 2.0 W/m-K, Test Method ASTM D5470
- Thermal Impedance
- 0.66 °C·in²/W, 1 mm at 10 psi, Typical Value, Test Method D5470
General Information
- Application
- Automation
- Gap Filler
- Lighting Device
- Key Features
- Cost Effectiveness
- Typical Uses
- Consumer electronics
- Memory & power modules
- Telecommunications equipment
- Sub-segment
- ECU
- Industry
- Automotive
- Consumer Electronics
- Technology and Telecommunications
Physical Properties
- Color
- Part A: Yellow
- Part B: White
- Cure Schedule
- 10 hours at 25 °C
- 30 min at 100 °C
- Hardness
- 50 Shore00, Test Method ASTM D2240
- Shelf Life
- 6 months Year
- Specific Gravity
- 2.8, Test Method ASTM D792
- Viscosity
- 200000-350000 cps, Test Method ASTM D2196
- Format
- Gel
Thermal Properties
- Thermal Conductivity
- 2.0 W/m-K, Test Method ASTM D5470
- Thermal Impedance
- 0.66 °C·in²/W, 1 mm at 10 psi, Typical Value, Test Method D5470
General Information
- Application
- Automation
- Gap Filler
- Lighting Device
- Key Features
- Cost Effectiveness
- Typical Uses
- Consumer electronics
- Memory & power modules
- Telecommunications equipment
- Sub-segment
- ECU
- Industry
- Automotive
- Consumer Electronics
- Technology and Telecommunications
- Viscosity : 200000-350000 cps, Test Method ASTM D2196
- Thermal Impedance : 0.66 °C·in²/W, 1 mm at 10 psi, Typical Value, Test Method D5470
- Thermal Conductivity : 2.0 W/m-K, Test Method ASTM D5470
- Specific Gravity : 2.8, Test Method ASTM D792
- Shelf Life : 6 months Year
- Hardness : 50 Shore00, Test Method ASTM D2240
- Format : Gel
- Cure Schedule : 10 hours at 25 °C|30 min at 100 °C
- Color : Part A: Yellow|Part B: White
- Application : Automation|Gap Filler|Lighting Device
- Typical Uses : Consumer electronics|Memory & power modules|Telecommunications equipment
- Sub-segment : ECU
- Key Features : Cost Effectiveness
- Industry : Automotive|Consumer Electronics|Technology and Telecommunications
Brochure
Name
Description
File Size
Date
Size
Thermal Interface Materials Electronics Brochure
application/pdf 821.77 KB
8/7/2025
821.77 KB
Name
Description
File Size
Date
Size
Thermal Interface Materials Electronics Brochure
application/pdf 821.77 KB
8/7/2025
821.77 KB
Name
Description
File Size
Date
Size
Thermal Interface Materials Electronics Brochure
821.77 KB
8/7/2025