Thermal Two-Part Hybrids
HLT10000
Honeywell HLT series products are two-component cured-in-place dispensable gap fillers could be easily dispensed w/good thixotropic characteristics and low viscosity, provides the high compressibility and excellent long term reliability. (10.0 W/m·K)
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Overview
Two-Part, Dispensable, Very Low Compression Force HLT series products are two-component, dispensable thermally conductive gels, which offer long-term reliability and superior softness. The enhanced bonding force between the polymer base and the filler minimizes oil separation issues in storage. Prior to curing, the material maintains good thixotropic characteristics and low viscosity to be easily dispensed.
Typical Applications
• Consumer electronics
• Telecommunications equipment
• Automotive electronics
• Memory & power modules
Features
• Low contact resistance
• Easily to dispense and rework
• High compressibility for low stress applications
• Long-term reliability
• Reduced oil separation
• No pump-out and cracking
Typical Applications
• Consumer electronics
• Telecommunications equipment
• Automotive electronics
• Memory & power modules
Features
• Low contact resistance
• Easily to dispense and rework
• High compressibility for low stress applications
• Long-term reliability
• Reduced oil separation
• No pump-out and cracking
Specifications
Thermal Properties
- Thermal Conductivity
- 10.0 W/m-K, Test Method ASTM D5470
Physical Properties
- Shelf Life
- 6 months Year
- Format
- Gel
General Information
- Application
- Automation
- CPU
- GPU
- Gap Filler
- Memory
- Power Device
- Key Features
- Easy to Dispense
- High Reliability
- Typical Uses
- Consumer electronics
- Memory & power modules
- Telecommunications equipment
- Sub-segment
- ADAS
- Industry
- Automotive
- Consumer Electronics
- Technology and Telecommunications
Thermal Properties
- Thermal Conductivity
- 10.0 W/m-K, Test Method ASTM D5470
Physical Properties
- Shelf Life
- 6 months Year
- Format
- Gel
General Information
- Application
- Automation
- CPU
- GPU
- Gap Filler
- Memory
- Power Device
- Key Features
- Easy to Dispense
- High Reliability
- Typical Uses
- Consumer electronics
- Memory & power modules
- Telecommunications equipment
- Sub-segment
- ADAS
- Industry
- Automotive
- Consumer Electronics
- Technology and Telecommunications
- Thermal Conductivity : 10.0 W/m-K, Test Method ASTM D5470
- Shelf Life : 6 months Year
- Format : Gel
- Application : Automation|CPU|GPU|Gap Filler|Memory|Power Device
- Typical Uses : Consumer electronics|Memory & power modules|Telecommunications equipment
- Sub-segment : ADAS
- Key Features : Easy to Dispense|High Reliability
- Industry : Automotive|Consumer Electronics|Technology and Telecommunications
Brochure
Name
Description
File Size
Date
Size
Thermal Interface Materials Electronics Brochure
application/pdf 821.77 KB
8/7/2025
821.77 KB
Name
Description
File Size
Date
Size
Thermal Interface Materials Electronics Brochure
application/pdf 821.77 KB
8/7/2025
821.77 KB
Name
Description
File Size
Date
Size
Thermal Interface Materials Electronics Brochure
821.77 KB
8/7/2025