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Thermal One-Part Hybrids
HT3500
Honeywell HT series products are precured one component, made of cross-linked silicone w/ceramic particles, dispensable and reworkable, high compressibility for low stress applications, no mixing, and additional curing or low temp storage (3.5 W/m·K)
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Overview
One-Part Dispensable Very Low Compression Force Thermal conductivity liquid gap fillers not only have the benefits of shape recovery, strong material cohesion, and good long-term thermal stability — they also offer a very low thermal resistance comparable to thermal grease, and can fill gaps at interfaces. Hybrid is a substance between liquid and solid, combining the advantages of thermal grease and thermal gap pad.Typical Applications• Consumer electronics• Telecommunications equipment• Automotive electronics• Power supplies & semiconductors• Memory & power modules• Power electronicsFeatures• High thermal performance and low contact resistance• Easily dispensable and reworkable• High compressibility for low stress applications • Long-term reliability• No pump-out or cracking risk• Reduced oil separation• Requires no mixing, additional curing or low temperature storage
Specifications
Thermal Properties
- Thermal Conductivity
- 3.5 W/m-K, Test Method ASTM D5470
- Thermal Impedance
- <0.35 °C·cm²/W, Test Method ASTM D5470 at BLT
Physical Properties
- Color
- Dark Red
- Dispense Rate
- >10 g/min, Test Method 90psi, 30cc EFD syringe
- Outgassing
- <0.5%, Test Method ASTM E595 (TML)
- Shelf Life
- 6 months Year
- Specific Gravity
- 3.2, Test Method ASTM D792
Temperature
- Storage Temperature
- RT
General Information
- Application
- Automation Gap Filler
- Key Features
- High compressibility for low stress applications
- High thermal performance and low contact resistance
- Long-term reliability
- No pump-out or cracking risk
- Reduced oil separation
- Typical Uses
- Consumer electronics
- Memory & power modules
- Power electronics
- Power supplies
- Telecommunications equipment
Thermal Properties
- Thermal Conductivity
- 3.5 W/m-K, Test Method ASTM D5470
- Thermal Impedance
- <0.35 °C·cm²/W, Test Method ASTM D5470 at BLT
Physical Properties
- Color
- Dark Red
- Dispense Rate
- >10 g/min, Test Method 90psi, 30cc EFD syringe
- Outgassing
- <0.5%, Test Method ASTM E595 (TML)
- Shelf Life
- 6 months Year
- Specific Gravity
- 3.2, Test Method ASTM D792
Temperature
- Storage Temperature
- RT
General Information
- Application
- Automation Gap Filler
- Key Features
- High compressibility for low stress applications
- High thermal performance and low contact resistance
- Long-term reliability
- No pump-out or cracking risk
- Reduced oil separation
- Typical Uses
- Consumer electronics
- Memory & power modules
- Power electronics
- Power supplies
- Telecommunications equipment
- Thermal Conductivity : 3.5 W/m-K, Test Method ASTM D5470
- Specific Gravity : 3.2, Test Method ASTM D792
- Shelf Life : 6 months Year
- Dispense Rate : >10 g/min, Test Method 90psi, 30cc EFD syringe
- Thermal Impedance : <0.35 °C·cm²/W, Test Method ASTM D5470 at BLT
- Outgassing : <0.5%, Test Method ASTM E595 (TML)
- Color : Dark Red
- Storage Temperature : RT
- Key Features : High compressibility for low stress applications|High thermal performance and low contact resistance|Long-term reliability|No pump-out or cracking risk|Reduced oil separation
- Application : Automation Gap Filler
- Typical Uses : Consumer electronics|Memory & power modules|Power electronics|Power supplies|Telecommunications equipment
Others
Name
Description
File Size
Date
Size
Thermal One-Part Hybrid: HT3500 - HT5000
application/pdf 57.29 KB
10/31/2023
57.29 KB
Brochure
Name
Description
File Size
Date
Size
Thermal Interface Materials Electronics Brochure
application/pdf 820.98 KB
10/31/2023
820.98 KB
Name
Description
File Size
Date
Size
Thermal One-Part Hybrid: HT3500 - HT5000
application/pdf 57.29 KB
10/31/2023
57.29 KB
Thermal Interface Materials Electronics Brochure
application/pdf 820.98 KB
10/31/2023
820.98 KB
Name
Description
File Size
Date
Size
Thermal One-Part Hybrid: HT3500 - HT5000
57.29 KB
10/31/2023
Thermal Interface Materials Electronics Brochure
820.98 KB
10/31/2023