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Thermal Gap Filler Pads
TGP3000
Low hardness provides low pressure versus deflection. It is naturally tacky, and requires no additional adhesive which could inhibit thermal performance. (Yellow color, 0.65 Thermal Impedance, 3.0 Thermal Conductivity, Hardness of 40 on Shore 00)
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Overview
Honeywell Thermal Gap Filler Pads (TGPs) provide high thermal performance with ease of use for many applications. Ultra-high compressibility enables low stress and excellent conformity to mating surfaces. Honeywell TGP models are naturally tacky, and require no additional adhesive which could inhibit thermal performance. TGP models have been designed to minimize thermal resistance at interfaces, and maintain effective performance through reliability testing. TGP models are silicone based, therefore they offer a certain anti-shock effect, with electrical isolation and non-flammability.Typical Applications• Consumer electronics• Telecommunications & network servers• Automotive electronics• Power devices & modules• Semiconductor logic & memoryFeatures• High thermal performance• Ultra-high compressibility for low stress applications• Excellent surface wetting for low contact resistance• High reliability• Electrically insulating
Specifications
Thermal Properties
- Thermal Conductivity
- 3.0 W/m-K, Test Method ASTM D5470
- Thermal Impedance
- 0.65 °C·in²/W, 1 mm at 10 psi, Typical Value, Test Method ASTM D5470
Physical Properties
- Color
- Yellow
- Hardness
- 40 Shore00, Test Method ASTM D2240
- Shelf Life
- 12 months Year
- Specific Gravity
- 3.1, Test Method ASTM D792
- Thickness (mm)
- 0.5-5, Test Method ASTM D374
Electrical Properties
- Dielectric Constant
- 6.6 at 1MHz, Test Method ASTM D150
- Volume Resistivity
- 4.8x1013 ohm-cm, Test Method ASTM D257
Flammability Properties
- Flammability
- V-0, Test Method UL94
General Information
- Application
- High Compressibility
- Key Features
- Low Hardness
- Typical Uses
- Consumer electronics
- Power devices & modules
- Semiconductor logic & memory
- Telecommunications & network servers
Thermal Properties
- Thermal Conductivity
- 3.0 W/m-K, Test Method ASTM D5470
- Thermal Impedance
- 0.65 °C·in²/W, 1 mm at 10 psi, Typical Value, Test Method ASTM D5470
Physical Properties
- Color
- Yellow
- Hardness
- 40 Shore00, Test Method ASTM D2240
- Shelf Life
- 12 months Year
- Specific Gravity
- 3.1, Test Method ASTM D792
- Thickness (mm)
- 0.5-5, Test Method ASTM D374
Electrical Properties
- Dielectric Constant
- 6.6 at 1MHz, Test Method ASTM D150
- Volume Resistivity
- 4.8x1013 ohm-cm, Test Method ASTM D257
Flammability Properties
- Flammability
- V-0, Test Method UL94
General Information
- Application
- High Compressibility
- Key Features
- Low Hardness
- Typical Uses
- Consumer electronics
- Power devices & modules
- Semiconductor logic & memory
- Telecommunications & network servers
- Thermal Conductivity : 3.0 W/m-K, Test Method ASTM D5470
- Specific Gravity : 3.1, Test Method ASTM D792
- Color : Yellow
- Thickness (mm) : 0.5-5, Test Method ASTM D374
- Hardness : 40 Shore00, Test Method ASTM D2240
- Thermal Impedance : 0.65 °C·in²/W, 1 mm at 10 psi, Typical Value, Test Method ASTM D5470
- Shelf Life : 12 months Year
- Dielectric Constant : 6.6 at 1MHz, Test Method ASTM D150
- Flammability : V-0, Test Method UL94
- Volume Resistivity : 4.8x1013 ohm-cm, Test Method ASTM D257
- Key Features : Low Hardness
- Application : High Compressibility
- Typical Uses : Consumer electronics|Power devices & modules|Semiconductor logic & memory|Telecommunications & network servers
Brochure
Name
Description
File Size
Date
Size
Thermal Interface Materials Electronics Brochure
application/pdf 820.98 KB
10/31/2023
820.98 KB
Name
Description
File Size
Date
Size
Thermal Interface Materials Electronics Brochure
application/pdf 820.98 KB
10/31/2023
820.98 KB
Name
Description
File Size
Date
Size
Thermal Interface Materials Electronics Brochure
820.98 KB
10/31/2023