Phase Change Materials
LTM6300-SP
LTM6300-SP is a Phase Change Paste with a Thermal Impedance of 0.04 (OC cm²/w), Thermal Conductivity of 2 (w/mk) and Specific Gravity of 1.8 (g/cm³)
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Overview
LTM6300-SP is the entry-level thermally conductive phase change Stencil printable paste. This paste minimizes thermal resistance at interfaces and maintains extremely stable performance through reliability testing required for long product life applications. In addition, it has excellent electrical properties and the highest volume resistivity of the entire phase change product line.
LTM6300-SP has a Thermal conductivity of 1.8 - 2.4 (W/m·K) depending on the bondline thickness. It is based on a robust polymer PCM structure that exhibits excellent wetting properties during typical operating temperature ranges, resulting in very low surface contact resistance. The proprietary material provides superior reliability and maintains low thermal impedance (0.4), making it desirable for high-performance integrated circuit devices.
LTM6300-SP has a Thermal conductivity of 1.8 - 2.4 (W/m·K) depending on the bondline thickness. It is based on a robust polymer PCM structure that exhibits excellent wetting properties during typical operating temperature ranges, resulting in very low surface contact resistance. The proprietary material provides superior reliability and maintains low thermal impedance (0.4), making it desirable for high-performance integrated circuit devices.
Specifications
Physical Properties
- Bond-Line Thickness (BLT)
- 0.038
- Specific Gravity
- 1.8 g/cm3, Test Method ASTM D374
- Viscosity
- 150
- Format
- Paste/Printable
Thermal Properties
- Thermal Conductivity
- 2.0 W/m-K, Test Method ASTM D5470
- Thermal Impedance
- 0.09-0.12 at no shim °C cm²/w, Test Method ASTM D5470 Modified
General Information
- Application
- IGBT Module
- Sub-segment
- Solar Converter
- Vertical
- Power Industry
- Industry
- Power industry
Physical Properties
- Bond-Line Thickness (BLT)
- 0.038
- Specific Gravity
- 1.8 g/cm3, Test Method ASTM D374
- Viscosity
- 150
- Format
- Paste/Printable
Thermal Properties
- Thermal Conductivity
- 2.0 W/m-K, Test Method ASTM D5470
- Thermal Impedance
- 0.09-0.12 at no shim °C cm²/w, Test Method ASTM D5470 Modified
General Information
- Application
- IGBT Module
- Sub-segment
- Solar Converter
- Vertical
- Power Industry
- Industry
- Power industry
- Format : Paste/Printable
- Bond-Line Thickness (BLT) : 0.038
- Thermal Conductivity : 2.0 W/m-K, Test Method ASTM D5470
- Thermal Impedance : 0.09-0.12 at no shim °C cm²/w, Test Method ASTM D5470 Modified
- Specific Gravity : 1.8 g/cm3, Test Method ASTM D374
- Viscosity : 150
- Sub-segment : Solar Converter
- Application : IGBT Module
- Vertical : Power Industry
- Industry : Power industry
Application Note
Name
Description
File Size
Date
Size
In Modern Electronic Devices
application/pdf 313.51 KB
6/12/2025
313.51 KB
Enhancing Performance and Reliability with TIM 1.5 Thermal Solutions
application/pdf 898.07 KB
6/12/2025
898.07 KB
Case Study
Name
Description
File Size
Date
Size
For New Energy Vehicle Inverters
application/pdf 3.31 MB
6/12/2025
3.31 MB
Name
Description
File Size
Date
Size
In Modern Electronic Devices
application/pdf 313.51 KB
6/12/2025
313.51 KB
For New Energy Vehicle Inverters
application/pdf 3.31 MB
6/12/2025
3.31 MB
Enhancing Performance and Reliability with TIM 1.5 Thermal Solutions
application/pdf 898.07 KB
6/12/2025
898.07 KB
Name
Description
File Size
Date
Size
Enhancing Performance and Reliability with TIM 1.5 Thermal Solutions
898.07 KB
6/12/2025
For New Energy Vehicle Inverters
3.31 MB
6/12/2025