ADVANCED MATERIALS

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Honeywell Thermally Conductive Putty Pads provide high thermal performance and solid thermal reliability. The material’s putty-like consistency enables excellent gap-filling capability for applications with large dimensional variances.

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Honeywell Thermally Conductive Putty Pads TGPXXXXPT series enables excellent gap-filling capability for applications with large dimensional variances. (3.5 W/m·K, ultra soft pad)

TGP3500PT

Honeywell Thermally Conductive Putty Pads TGPXXXXPT series enables excellent gap-filling capability for applications with large dimensional variances. (8.0 W/m·K, ultra soft pad)

TGP3510PT

Honeywell Thermally Conductive Putty Pads TGPXXXXPT series enables excellent gap-filling capability for applications with large dimensional variances. (6.0 W/m·K, ultra soft pad)

TGP6000PT

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