Thermal Gap Filler Pads
TGP3000
Low hardness provides low pressure versus deflection. It is naturally tacky, and requires no additional adhesive which could inhibit thermal performance. (Yellow color, 0.65 Thermal Impedance, 3.0 Thermal Conductivity, Hardness of 40 on Shore 00)
Physical Properties
- Color
- Yellow
- Hardness
- 40 Shore00, Test Method ASTM D2240
- Shelf Life
- 12 months Year
- Specific Gravity
- 3.1, Test Method ASTM D792
- Thickness (mm)
- 0.5-5, Test Method ASTM D374
Thermal Properties
- Thermal Conductivity
- 3.0 W/m-K, Test Method ASTM D5470
- Thermal Impedance
- 0.65 °C·in²/W, 1 mm at 10 psi, Typical Value, Test Method ASTM D5470
Flammability Properties
- Flammability
- V-0, Test Method UL94
Electrical Properties
- Dielectric Constant
- 6.6 at 1MHz, Test Method ASTM D150
- Volume Resistivity
- 4.8x1013 ohm-cm, Test Method ASTM D257
General Information
- Application
- High Compressibility
- Key Features
- Low Hardness
- Typical Uses
- Consumer electronics
- Power devices & modules
- Semiconductor logic & memory
- Telecommunications & network servers
Physical Properties
- Color
- Yellow
- Hardness
- 40 Shore00, Test Method ASTM D2240
- Shelf Life
- 12 months Year
- Specific Gravity
- 3.1, Test Method ASTM D792
- Thickness (mm)
- 0.5-5, Test Method ASTM D374
Thermal Properties
- Thermal Conductivity
- 3.0 W/m-K, Test Method ASTM D5470
- Thermal Impedance
- 0.65 °C·in²/W, 1 mm at 10 psi, Typical Value, Test Method ASTM D5470
Flammability Properties
- Flammability
- V-0, Test Method UL94
Electrical Properties
- Dielectric Constant
- 6.6 at 1MHz, Test Method ASTM D150
- Volume Resistivity
- 4.8x1013 ohm-cm, Test Method ASTM D257
General Information
- Application
- High Compressibility
- Key Features
- Low Hardness
- Typical Uses
- Consumer electronics
- Power devices & modules
- Semiconductor logic & memory
- Telecommunications & network servers
- Shelf Life : 12 months Year
- Hardness : 40 Shore00, Test Method ASTM D2240
- Color : Yellow
- Thermal Conductivity : 3.0 W/m-K, Test Method ASTM D5470
- Thickness (mm) : 0.5-5, Test Method ASTM D374
- Thermal Impedance : 0.65 °C·in²/W, 1 mm at 10 psi, Typical Value, Test Method ASTM D5470
- Specific Gravity : 3.1, Test Method ASTM D792
- Flammability : V-0, Test Method UL94
- Dielectric Constant : 6.6 at 1MHz, Test Method ASTM D150
- Volume Resistivity : 4.8x1013 ohm-cm, Test Method ASTM D257
- Key Features : Low Hardness
- Application : High Compressibility
- Typical Uses : Consumer electronics|Power devices & modules|Semiconductor logic & memory|Telecommunications & network servers