Thermal Putty Pads
TGP3510PT
Honeywell Thermally Conductive Putty Pads TGPXXXXPT series enables excellent gap-filling capability for applications with large dimensional variances. (8.0 W/m·K, ultra soft pad)
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Overview
Honeywell Thermally Conductive Putty Pads provide high thermal performance and solid thermal reliability. The material’s putty-like consistency enables excellent gap-filling capability for applications with large dimensional variances. Special surface reinforcement enables easier handling for operators, with no pull-out during high-volume assembly. The product is naturally tacky and requires no additional adhesive to mate to the heat source and heat sink.
Typical Applications
• EV battery & charging station
• Automotive electronics
• Power devices & modules
• Telecommunications & network servers
Features
• High thermal performance
• Ultra-soft
• High compressibility
• Excellent gap-filling capability
• Naturally tacky
Typical Applications
• EV battery & charging station
• Automotive electronics
• Power devices & modules
• Telecommunications & network servers
Features
• High thermal performance
• Ultra-soft
• High compressibility
• Excellent gap-filling capability
• Naturally tacky
Specifications
Physical Properties
- Color
- Green
- Hardness
- 5 Shore00, Test Method ASTM D2240
- Shelf Life
- 12 months Year
- Specific Gravity
- 3.2, Test Method ASTM D792
- Thickness (mm)
- 0.5-5, Test Method ASTM D374
- Format
- Pad
Thermal Properties
- Thermal Conductivity
- 3.5 W/m-K, Test Method ASTM D5470
- Thermal Impedance
- 0.45 °C·in²/W, 1 mm at 10 psi, Typical Value, Test Method ASTM D5470
Electrical Properties
- Dielectric Constant
- 6.4 @ 1MHz, Test Method ASTM D150
- Volume Resistivity
- 4.0x10<sup>13</sup> ohm-cm, Test Method ASTM D257
Flammability Properties
- Flammability
- V-0, Test Method UL94
General Information
- Application
- Gap Filler
- High Compressibility
- Power Device
- Power Module
- Key Features
- Extra Soft
- Typical Uses
- Automotive Electronics
- Sub-segment
- Base Station
- Server
- Industry
- Automotive
Physical Properties
- Color
- Green
- Hardness
- 5 Shore00, Test Method ASTM D2240
- Shelf Life
- 12 months Year
- Specific Gravity
- 3.2, Test Method ASTM D792
- Thickness (mm)
- 0.5-5, Test Method ASTM D374
- Format
- Pad
Thermal Properties
- Thermal Conductivity
- 3.5 W/m-K, Test Method ASTM D5470
- Thermal Impedance
- 0.45 °C·in²/W, 1 mm at 10 psi, Typical Value, Test Method ASTM D5470
Electrical Properties
- Dielectric Constant
- 6.4 @ 1MHz, Test Method ASTM D150
- Volume Resistivity
- 4.0x10<sup>13</sup> ohm-cm, Test Method ASTM D257
Flammability Properties
- Flammability
- V-0, Test Method UL94
General Information
- Application
- Gap Filler
- High Compressibility
- Power Device
- Power Module
- Key Features
- Extra Soft
- Typical Uses
- Automotive Electronics
- Sub-segment
- Base Station
- Server
- Industry
- Automotive
- Thickness (mm) : 0.5-5, Test Method ASTM D374
- Thermal Impedance : 0.45 °C·in²/W, 1 mm at 10 psi, Typical Value, Test Method ASTM D5470
- Thermal Conductivity : 3.5 W/m-K, Test Method ASTM D5470
- Specific Gravity : 3.2, Test Method ASTM D792
- Shelf Life : 12 months Year
- Hardness : 5 Shore00, Test Method ASTM D2240
- Format : Pad
- Color : Green
- Volume Resistivity : 4.0x1013 ohm-cm, Test Method ASTM D257
- Dielectric Constant : 6.4 @ 1MHz, Test Method ASTM D150
- Flammability : V-0, Test Method UL94
- Application : Gap Filler|High Compressibility|Power Device|Power Module
- Typical Uses : Automotive Electronics
- Sub-segment : Base Station|Server
- Key Features : Extra Soft
- Industry : Automotive
Brochure
Name
Description
File Size
Date
Size
Thermal Interface Materials Electronics Brochure
application/pdf 821.77 KB
8/7/2025
821.77 KB
Data Sheet
Name
Description
File Size
Date
Size
Technical Data Sheet
application/pdf 47.49 KB
10/31/2023
47.49 KB
Name
Description
File Size
Date
Size
Technical Data Sheet
application/pdf 47.49 KB
10/31/2023
47.49 KB
Thermal Interface Materials Electronics Brochure
application/pdf 821.77 KB
8/7/2025
821.77 KB
Name
Description
File Size
Date
Size
Thermal Interface Materials Electronics Brochure
821.77 KB
8/7/2025