Phase Change Materials
PTM6000HV-SP
PTM6000HV is a Phase Change Paste with a Thermal Impedance of 0.08 - 0.10 (°C cm²/w), Thermal Conductivity of 5.2 (w/mk) and Specific Gravity of 2.6 (g/cm³). The material is Optimized for IGBT printing and honeycomb structures.
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Overview
PTM6000HV is a highly thermally conductive Phase Change Material (PCM) in paste format. This high-viscosity (HV) version of PTM6000-SP is designed to minimize thermal resistance at interfaces and maintain extremely stable performance through reliability testing required for long product life applications. Its wide process window makes it an optimal, tailor-made option for IGBT printing and honeycomb structures.
PTM6000HV is based on a robust polymer PCM structure and exhibits excellent wetting properties at interfaces during typical operating temperature ranges, resulting in very low surface contact resistance.
PTM6000HV is a proprietary material that uses a proprietary filler to provide superior reliability (pass 150˚C baking 2000 hours, temperature cycling 2000 cycles, and HAST 288 hours) and maintains low thermal impedance (<0.12˚Ccm2/W no shim), making PTM6000HV desirable for high-performance integrated circuit devices.
PTM6000HV is based on a robust polymer PCM structure and exhibits excellent wetting properties at interfaces during typical operating temperature ranges, resulting in very low surface contact resistance.
PTM6000HV is a proprietary material that uses a proprietary filler to provide superior reliability (pass 150˚C baking 2000 hours, temperature cycling 2000 cycles, and HAST 288 hours) and maintains low thermal impedance (<0.12˚Ccm2/W no shim), making PTM6000HV desirable for high-performance integrated circuit devices.
Specifications
Physical Properties
- Bond-Line Thickness (BLT)
- 0.038
- Color
- Grey
- Shelf Life
- 12 months Year
- Specific Gravity
- 2.6 g/cm3, Test Method ASTM D374
- Viscosity
- 200-460
- Format
- Paste
- Stencil Printable
- Drying Type
- Extend
Thermal Properties
- Thermal Conductivity
- 5.2 W/m-K, Test Method ASTM D5470
- Thermal Impedance
- 0.08-0.10 at no shim °C cm²/w, Test Method ASTM D5470 Modified
General Information
- Application
- IGBT Module
- Thin Bondline
- Key Features
- High Reliability
- Sub-segment
- Solar Converter
- Industry
- Energy
Other
- Other Notes
- Stencil printable (SP) available in 300cc syringes or 1kg jars
Physical Properties
- Bond-Line Thickness (BLT)
- 0.038
- Color
- Grey
- Shelf Life
- 12 months Year
- Specific Gravity
- 2.6 g/cm3, Test Method ASTM D374
- Viscosity
- 200-460
- Format
- Paste
- Stencil Printable
- Drying Type
- Extend
Thermal Properties
- Thermal Conductivity
- 5.2 W/m-K, Test Method ASTM D5470
- Thermal Impedance
- 0.08-0.10 at no shim °C cm²/w, Test Method ASTM D5470 Modified
General Information
- Application
- IGBT Module
- Thin Bondline
- Key Features
- High Reliability
- Sub-segment
- Solar Converter
- Industry
- Energy
Other
- Other Notes
- Stencil printable (SP) available in 300cc syringes or 1kg jars
- Viscosity : 200-460
- Thermal Impedance : 0.08-0.10 at no shim °C cm²/w, Test Method ASTM D5470 Modified
- Thermal Conductivity : 5.2 W/m-K, Test Method ASTM D5470
- Specific Gravity : 2.6 g/cm3, Test Method ASTM D374
- Shelf Life : 12 months Year
- Format : Paste|Stencil Printable
- Drying Type : Extend
- Color : Grey
- Bond-Line Thickness (BLT) : 0.038
- Application : IGBT Module|Thin Bondline
- Sub-segment : Solar Converter
- Key Features : High Reliability
- Industry : Energy
- Other Notes : Stencil printable (SP) available in 300cc syringes or 1kg jars
Application Note
Name
Description
File Size
Date
Size
In Modern Electronic Devices
application/pdf 316.14 KB
8/11/2025
316.14 KB
Enhancing Performance and Reliability with TIM 1.5 Thermal Solutions
application/pdf 900.68 KB
8/7/2025
900.68 KB
Brochure
Name
Description
File Size
Date
Size
Thermal Interface Materials Electronics Brochure
application/pdf 821.77 KB
8/7/2025
821.77 KB
Case Study
Name
Description
File Size
Date
Size
For New Energy Vehicle Inverters
application/pdf 3.31 MB
6/12/2025
3.31 MB
Name
Description
File Size
Date
Size
In Modern Electronic Devices
application/pdf 316.14 KB
8/11/2025
316.14 KB
Thermal Interface Materials Electronics Brochure
application/pdf 821.77 KB
8/7/2025
821.77 KB
For New Energy Vehicle Inverters
application/pdf 3.31 MB
6/12/2025
3.31 MB
Enhancing Performance and Reliability with TIM 1.5 Thermal Solutions
application/pdf 900.68 KB
8/7/2025
900.68 KB
Name
Description
File Size
Date
Size
Enhancing Performance and Reliability with TIM 1.5 Thermal Solutions
900.68 KB
8/7/2025
Thermal Interface Materials Electronics Brochure
821.77 KB
8/7/2025
For New Energy Vehicle Inverters
3.31 MB
6/12/2025