PCM45F-SP

PCM45F-SP is a thermally conductive phase change paste available in Stencil printable form. It is designed to minimize thermal resistance at interfaces and maintain extremely stable performance through reliability testing for long product life applications. In addition to that, it has excellent electrical properties and very high-volume resistivity. After the PCM paste has been printed and dried, the material behaves like a pad.  All other installations are the same. The material is solid below 45oC, soft, and gel-like above this temperature.  After the first phase change cycle, it reverts back and forth from solid to gel at around 45 to 50oC.  This property is critical for compliance at higher temperatures and performs better than any grease under temperature and power cycling testing.  Ions are not very mobile, like grease. Therefore, it does not pump and dry out from under the chip.

PCM45F-SP has a Thermal conductivity of 2.0 - 2.5 (W/m·K) depending on the bondline thickness. It is based on a robust polymer PCM structure that exhibits excellent wetting properties during typical operating temperature ranges, resulting in very low surface contact resistance. The proprietary material provides superior reliability and maintains low thermal impedance (0.09-0.12), making it desirable for high-performance integrated circuit devices.