Phase Change Materials
PCM45F
PCM45F is a Phase Change Pad with a Thermal Impedance of 0.09 – 0.12 (OC cm²/w), Thermal Conductivity of 2 (w/mk) and Specific Gravity of 2.2 (g/cm³).
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Overview
PCM45F is Honeywell's thermally conductive phase change pad. It is designed to minimize thermal resistance at interfaces and maintain extremely stable performance through reliability testing for long product life applications. In addition, it has excellent electrical properties and very high-volume resistivity.PCM45F has a Thermal conductivity of 2.0 - 2.5 (W/m·K) depending on the bondline thickness. It is based on a robust polymer PCM structure that exhibits excellent wetting properties during typical operating temperature ranges, resulting in very low surface contact resistance. The proprietary material provides superior reliability and maintains low thermal impedance (0.09-0.12), making it desirable for high-performance integrated circuit devices.
Specifications
Physical Properties
- Color
- No data available
- Shelf Life
- 12 months Year
- Specific Gravity
- 2.2, Test Method ASTM D374
- Thickness (mm)
- 0.20-1.00
Thermal Properties
- Thermal Conductivity
- 2.0-2.5 W/m-K, Test Method ASTM D5470
- Thermal Impedance
- 0.09-0.12 at no shim °C·cm²/W, Test Method ASTM D5470 Modified
Electrical Properties
- Volume Resistivity
- 8.2x1014 ohm-cm, Test Method ASTM D258
General Information
- Application
- Networks
- Key Features
- High Reliability
- Typical Uses
- IGBT
- Lighting
- Power control unit, inverter, onboard electronics
- Servers, supercomputing, video graphic array (VGA) cards, AI, GPU/CPU/Desktop, solid state drives (SSD)
- Switches, routers, base stations
- Tablets, gaming, notebooks, smartphones, action cameras
- Industry
- Telecom/Data Center
Physical Properties
- Color
- No data available
- Shelf Life
- 12 months Year
- Specific Gravity
- 2.2, Test Method ASTM D374
- Thickness (mm)
- 0.20-1.00
Thermal Properties
- Thermal Conductivity
- 2.0-2.5 W/m-K, Test Method ASTM D5470
- Thermal Impedance
- 0.09-0.12 at no shim °C·cm²/W, Test Method ASTM D5470 Modified
Electrical Properties
- Volume Resistivity
- 8.2x1014 ohm-cm, Test Method ASTM D258
General Information
- Application
- Networks
- Key Features
- High Reliability
- Typical Uses
- IGBT
- Lighting
- Power control unit, inverter, onboard electronics
- Servers, supercomputing, video graphic array (VGA) cards, AI, GPU/CPU/Desktop, solid state drives (SSD)
- Switches, routers, base stations
- Tablets, gaming, notebooks, smartphones, action cameras
- Industry
- Telecom/Data Center
- Thickness (mm) : 0.20-1.00
- Thermal Impedance : 0.09-0.12 at no shim °C·cm²/W, Test Method ASTM D5470 Modified
- Thermal Conductivity : 2.0-2.5 W/m-K, Test Method ASTM D5470
- Specific Gravity : 2.2, Test Method ASTM D374
- Shelf Life : 12 months Year
- Color : No data available
- Volume Resistivity : 8.2x1014 ohm-cm, Test Method ASTM D258
- Application : Networks
- Typical Uses : IGBT|Lighting|Power control unit, inverter, onboard electronics|Servers, supercomputing, video graphic array (VGA) cards, AI, GPU/CPU/Desktop, solid state drives (SSD)|Switches, routers, base stations|Tablets, gaming, notebooks, smartphones, action cameras
- Key Features : High Reliability
- Industry : Telecom/Data Center
Others
Name
Description
File Size
Date
Size
Phase Change Materials: LTM6300 - PCM45F -PTM5000
application/pdf 64.53 KB
10/31/2023
64.53 KB
Brochure
Name
Description
File Size
Date
Size
Thermal Interface Materials Electronics Brochure
application/pdf 820.98 KB
10/31/2023
820.98 KB
Name
Description
File Size
Date
Size
Phase Change Materials: LTM6300 - PCM45F -PTM5000
application/pdf 64.53 KB
10/31/2023
64.53 KB
Thermal Interface Materials Electronics Brochure
application/pdf 820.98 KB
10/31/2023
820.98 KB
Name
Description
File Size
Date
Size
Phase Change Materials: LTM6300 - PCM45F -PTM5000
64.53 KB
10/31/2023
Thermal Interface Materials Electronics Brochure
820.98 KB
10/31/2023