Thermal One-Part Hybrids
HT10000
Honeywell HT series products are precured one component, made of cross-linked silicone w/ceramic particles, dispensable and reworkable, high compressibility for low stress applications, no mixing, and additional curing or low temp storage(10.0 W/m·K)
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Overview
One-Part Dispensable Very Low Compression Force Thermal conductivity liquid gap fillers not only have the benefits of shape recovery, strong material cohesion, and good long-term thermal stability — they also offer a very low thermal resistance comparable to thermal grease, and can fill gaps at interfaces. Hybrid is a substance between liquid and solid, combining the advantages of thermal grease and thermal gap pad.
Typical Applications
• Consumer electronics
• Telecommunications equipment
• Automotive electronics
• Power supplies & semiconductors
• Memory & power modules
• Power electronics
Features
• High thermal performance and low contact resistance
• Easily dispensable and reworkable
• High compressibility for low stress applications
• Long-term reliability
• No pump-out or cracking risk
• Reduced oil separation
• Requires no mixing, additional curing or low temperature storage
Typical Applications
• Consumer electronics
• Telecommunications equipment
• Automotive electronics
• Power supplies & semiconductors
• Memory & power modules
• Power electronics
Features
• High thermal performance and low contact resistance
• Easily dispensable and reworkable
• High compressibility for low stress applications
• Long-term reliability
• No pump-out or cracking risk
• Reduced oil separation
• Requires no mixing, additional curing or low temperature storage
Specifications
Thermal Properties
- Thermal Conductivity
- 10.0 W/m-K, Test Method ASTM D5470
- Thermal Impedance
- N/A
Physical Properties
- Color
- N/A
- Dispense Rate
- N/A
- Outgassing
- N/A
- Shelf Life
- 6 months Year
General Information
- Application
- Automation Gap Filler
- Key Features
- Low oil bleeding
- Pre-cure
- Typical Uses
- Consumer electronics
- Memory & power modules
- Power electronics
- Power supplies
- Telecommunications equipment
- Storage Temperature
- N/A
- Industry
- Automotive
- Consumer Electronics
- Technology and Telecommunications
Thermal Properties
- Thermal Conductivity
- 10.0 W/m-K, Test Method ASTM D5470
- Thermal Impedance
- N/A
Physical Properties
- Color
- N/A
- Dispense Rate
- N/A
- Outgassing
- N/A
- Shelf Life
- 6 months Year
General Information
- Application
- Automation Gap Filler
- Key Features
- Low oil bleeding
- Pre-cure
- Typical Uses
- Consumer electronics
- Memory & power modules
- Power electronics
- Power supplies
- Telecommunications equipment
- Storage Temperature
- N/A
- Industry
- Automotive
- Consumer Electronics
- Technology and Telecommunications
- Thermal Impedance : N/A
- Thermal Conductivity : 10.0 W/m-K, Test Method ASTM D5470
- Shelf Life : 6 months Year
- Outgassing : N/A
- Dispense Rate : N/A
- Color : N/A
- Application : Automation Gap Filler
- Typical Uses : Consumer electronics|Memory & power modules|Power electronics|Power supplies|Telecommunications equipment
- Storage Temperature : N/A
- Key Features : Low oil bleeding|Pre-cure
- Industry : Automotive|Consumer Electronics|Technology and Telecommunications
Brochure
Name
Description
File Size
Date
Size
Thermal Interface Materials Electronics Brochure
application/pdf 821.77 KB
8/7/2025
821.77 KB
Name
Description
File Size
Date
Size
Thermal Interface Materials Electronics Brochure
application/pdf 821.77 KB
8/7/2025
821.77 KB
Name
Description
File Size
Date
Size
Thermal Interface Materials Electronics Brochure
821.77 KB
8/7/2025