Thermal Grease
TG5500
Honeywell silicone grease products provide superior thermal performance with ease of use across many applications. Provides low viscosity and inherent thixotropy for large-scale production with dispensing and screen and stencil printing. (5.5 W/m·K)
Please sign in to access more documents
Once signed in, you may be able to access additional documents for your account.
Physical Properties
- Bond-Line Thickness (BLT)
- 23 µm at 35 psi, 50 °C, Test Method HON Internal
- Color
- Grey
- Shelf Life
- 12 months Year
- Specific Gravity
- 2.5, Test Method ASTM D374
- Viscosity
- 300000 cps at 25 °C, Test Method Brookfield Viscometer
Thermal Properties
- Thermal Conductivity
- 5.5 W/m-K, Test Method Hot Disk
- Thermal Impedance
- 0.010 °C·in²/W, 35 psi, 50 °C, Test Method ASTM D5470
Flammability Properties
- Flammability
- V-0, Test Method UL94
- Working Temperature
- -40-150 °C
Electrical Properties
- Dielectric Constant
- >10 at 1MHz, Test Method ASTM D150
- Volume Resistivity
- 1.0x1012 ohm-cm, Test Method ASTM D257
Temperature
- Storage Temperature
- Room Temperature
General Information
- Application
- Thin Bondline
- Key Features
- High TC
- Low TI
- Typical Uses
- Flipchip BGAs
- IGBT & power units
- LED assemblies
Physical Properties
- Bond-Line Thickness (BLT)
- 23 µm at 35 psi, 50 °C, Test Method HON Internal
- Color
- Grey
- Shelf Life
- 12 months Year
- Specific Gravity
- 2.5, Test Method ASTM D374
- Viscosity
- 300000 cps at 25 °C, Test Method Brookfield Viscometer
Thermal Properties
- Thermal Conductivity
- 5.5 W/m-K, Test Method Hot Disk
- Thermal Impedance
- 0.010 °C·in²/W, 35 psi, 50 °C, Test Method ASTM D5470
Flammability Properties
- Flammability
- V-0, Test Method UL94
- Working Temperature
- -40-150 °C
Electrical Properties
- Dielectric Constant
- >10 at 1MHz, Test Method ASTM D150
- Volume Resistivity
- 1.0x1012 ohm-cm, Test Method ASTM D257
Temperature
- Storage Temperature
- Room Temperature
General Information
- Application
- Thin Bondline
- Key Features
- High TC
- Low TI
- Typical Uses
- Flipchip BGAs
- IGBT & power units
- LED assemblies
- Bond-Line Thickness (BLT) : 23 µm at 35 psi, 50 °C, Test Method HON Internal
- Viscosity : 300000 cps at 25 °C, Test Method Brookfield Viscometer
- Color : Grey
- Specific Gravity : 2.5, Test Method ASTM D374
- Thermal Impedance : 0.010 °C·in²/W, 35 psi, 50 °C, Test Method ASTM D5470
- Thermal Conductivity : 5.5 W/m-K, Test Method Hot Disk
- Shelf Life : 12 months Year
- Flammability : V-0, Test Method UL94
- Volume Resistivity : 1.0x1012 ohm-cm, Test Method ASTM D257
- Dielectric Constant : >10 at 1MHz, Test Method ASTM D150
- Storage Temperature : Room Temperature
- Working Temperature : -40-150 °C
- Typical Uses : Flipchip BGAs|IGBT & power units|LED assemblies
- Key Features : High TC|Low TI
- Application : Thin Bondline