Thermal Grease
TG3000I
Honeywell silicone grease products provide superior thermal performance w/ease of use across many applications. Provides low viscosity & inherent thixotropy for large-scale production w/dispensing and screen and stencil printing.(3.0 W/m·K, BLT 10µm)
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Physical Properties
- Bond-Line Thickness (BLT)
- 10 µm at 35 psi, 50 °C, Test Method HON Internal
- Color
- White
- Shelf Life
- 12 months Year
- Specific Gravity
- 3.4, Test Method ASTM D792
- Viscosity
- 200000 cps at 25 °C, Test Method Brookfield Viscometer
Thermal Properties
- Thermal Conductivity
- 3.0 W/m-K, Test Method Hot Disk
- Thermal Impedance
- 0.003 °C·in²/W, 35 psi, 50 °C, Test Method ASTM D5470
Electrical Properties
- Dielectric Constant
- >10 at 1MHz, Test Method ASTM D150
- Volume Resistivity
- 2.0x1012 ohm-cm, Test Method ASTM D257
Flammability Properties
- Flammability
- V-0, Test Method UL94
- Working Temperature
- -40-150 °C
Temperature
- Storage Temperature
- Room Temperature
General Information
- Application
- Thin Bondline
- Key Features
- Cost effectiveness
- Electrical isolation
- Typical Uses
- Flipchip BGAs
- IGBT & power units
- LED assemblies
Physical Properties
- Bond-Line Thickness (BLT)
- 10 µm at 35 psi, 50 °C, Test Method HON Internal
- Color
- White
- Shelf Life
- 12 months Year
- Specific Gravity
- 3.4, Test Method ASTM D792
- Viscosity
- 200000 cps at 25 °C, Test Method Brookfield Viscometer
Thermal Properties
- Thermal Conductivity
- 3.0 W/m-K, Test Method Hot Disk
- Thermal Impedance
- 0.003 °C·in²/W, 35 psi, 50 °C, Test Method ASTM D5470
Electrical Properties
- Dielectric Constant
- >10 at 1MHz, Test Method ASTM D150
- Volume Resistivity
- 2.0x1012 ohm-cm, Test Method ASTM D257
Flammability Properties
- Flammability
- V-0, Test Method UL94
- Working Temperature
- -40-150 °C
Temperature
- Storage Temperature
- Room Temperature
General Information
- Application
- Thin Bondline
- Key Features
- Cost effectiveness
- Electrical isolation
- Typical Uses
- Flipchip BGAs
- IGBT & power units
- LED assemblies
- Bond-Line Thickness (BLT) : 10 µm at 35 psi, 50 °C, Test Method HON Internal
- Thermal Conductivity : 3.0 W/m-K, Test Method Hot Disk
- Shelf Life : 12 months Year
- Color : White
- Specific Gravity : 3.4, Test Method ASTM D792
- Viscosity : 200000 cps at 25 °C, Test Method Brookfield Viscometer
- Thermal Impedance : 0.003 °C·in²/W, 35 psi, 50 °C, Test Method ASTM D5470
- Volume Resistivity : 2.0x1012 ohm-cm, Test Method ASTM D257
- Flammability : V-0, Test Method UL94
- Dielectric Constant : >10 at 1MHz, Test Method ASTM D150
- Storage Temperature : Room Temperature
- Working Temperature : -40-150 °C
- Typical Uses : Flipchip BGAs|IGBT & power units|LED assemblies
- Key Features : Cost effectiveness|Electrical isolation
- Application : Thin Bondline