Thermal Grease
TG2800I
Honeywell silicone grease products provide superior thermal performance with ease of use across many applications. Provides low viscosity and inherent thixotropy for large-scale production with dispensing and screen and stencil printing. (2.8 W/m·K)
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Physical Properties
- Bond-Line Thickness (BLT)
- 25 µm at 35 psi, 50 °C, Test Method HON Internal
- Color
- Yellow
- Shelf Life
- 12 months Year
- Specific Gravity
- 4.2, Test Method ASTM D792
- Viscosity
- 100000 cps at 25 °C, Test Method Brookfield Viscometer
Thermal Properties
- Thermal Conductivity
- 2.8 W/m-K, Test Method Hot Disk
- Thermal Impedance
- 0.009 °C·in²/W, 35 psi, 50 °C, Test Method ASTM D5470
Electrical Properties
- Dielectric Constant
- >14 at 1MHz, Test Method ASTM D150
- Volume Resistivity
- 1.3x1013 ohm-cm, Test Method ASTM D257
Flammability Properties
- Flammability
- V-0, Test Method UL94
- Working Temperature
- -40-150 °C
Temperature
- Storage Temperature
- Room Temperature
General Information
- Application
- Thin Bondline
- Key Features
- Cost effectiveness
- Electrical isolation
- Typical Uses
- Flipchip BGAs
- IGBT & power units
- LED assemblies
Physical Properties
- Bond-Line Thickness (BLT)
- 25 µm at 35 psi, 50 °C, Test Method HON Internal
- Color
- Yellow
- Shelf Life
- 12 months Year
- Specific Gravity
- 4.2, Test Method ASTM D792
- Viscosity
- 100000 cps at 25 °C, Test Method Brookfield Viscometer
Thermal Properties
- Thermal Conductivity
- 2.8 W/m-K, Test Method Hot Disk
- Thermal Impedance
- 0.009 °C·in²/W, 35 psi, 50 °C, Test Method ASTM D5470
Electrical Properties
- Dielectric Constant
- >14 at 1MHz, Test Method ASTM D150
- Volume Resistivity
- 1.3x1013 ohm-cm, Test Method ASTM D257
Flammability Properties
- Flammability
- V-0, Test Method UL94
- Working Temperature
- -40-150 °C
Temperature
- Storage Temperature
- Room Temperature
General Information
- Application
- Thin Bondline
- Key Features
- Cost effectiveness
- Electrical isolation
- Typical Uses
- Flipchip BGAs
- IGBT & power units
- LED assemblies
- Color : Yellow
- Thermal Conductivity : 2.8 W/m-K, Test Method Hot Disk
- Specific Gravity : 4.2, Test Method ASTM D792
- Bond-Line Thickness (BLT) : 25 µm at 35 psi, 50 °C, Test Method HON Internal
- Viscosity : 100000 cps at 25 °C, Test Method Brookfield Viscometer
- Thermal Impedance : 0.009 °C·in²/W, 35 psi, 50 °C, Test Method ASTM D5470
- Shelf Life : 12 months Year
- Volume Resistivity : 1.3x1013 ohm-cm, Test Method ASTM D257
- Flammability : V-0, Test Method UL94
- Dielectric Constant : >14 at 1MHz, Test Method ASTM D150
- Storage Temperature : Room Temperature
- Working Temperature : -40-150 °C
- Application : Thin Bondline
- Typical Uses : Flipchip BGAs|IGBT & power units|LED assemblies
- Key Features : Cost effectiveness|Electrical isolation