Thermal Gap Filler Pads
TGP1500
Naturally tacky with better thermal performance and ease of use across a multitude of applications. (Grey color, 0.94 Thermal Impedance, 1.5 Thermal Conductivity, Thickness 0.5 - 5 mm, Hardness 40 Shore 00)
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Physical Properties
- Color
- Grey
- Hardness
- 40 Shore00, Test Method ASTM D2240
- Shelf Life
- 12 months Year
- Specific Gravity
- 1.8, Test Method ASTM D792
- Thickness (mm)
- 0.5-5, Test Method ASTM D374
Thermal Properties
- Thermal Conductivity
- 1.5 W/m-K, Test Method ASTM D5470
- Thermal Impedance
- 0.94 °C·in²/W, 1 mm at 10 psi, Typical Value, Test Method ASTM D5470
Electrical Properties
- Dielectric Constant
- 5.5 at 1MHz, Test Method ASTM D150
- Volume Resistivity
- 2.0x1013 ohm-cm, Test Method ASTM D257
Flammability Properties
- Flammability
- V-0, Test Method UL94
General Information
- Application
- High Compressibility
- Key Features
- Cost effectiveness
- Typical Uses
- Consumer electronics
- Power devices & modules
- Semiconductor logic & memory
- Telecommunications & network servers
Physical Properties
- Color
- Grey
- Hardness
- 40 Shore00, Test Method ASTM D2240
- Shelf Life
- 12 months Year
- Specific Gravity
- 1.8, Test Method ASTM D792
- Thickness (mm)
- 0.5-5, Test Method ASTM D374
Thermal Properties
- Thermal Conductivity
- 1.5 W/m-K, Test Method ASTM D5470
- Thermal Impedance
- 0.94 °C·in²/W, 1 mm at 10 psi, Typical Value, Test Method ASTM D5470
Electrical Properties
- Dielectric Constant
- 5.5 at 1MHz, Test Method ASTM D150
- Volume Resistivity
- 2.0x1013 ohm-cm, Test Method ASTM D257
Flammability Properties
- Flammability
- V-0, Test Method UL94
General Information
- Application
- High Compressibility
- Key Features
- Cost effectiveness
- Typical Uses
- Consumer electronics
- Power devices & modules
- Semiconductor logic & memory
- Telecommunications & network servers
- Specific Gravity : 1.8, Test Method ASTM D792
- Thermal Conductivity : 1.5 W/m-K, Test Method ASTM D5470
- Shelf Life : 12 months Year
- Hardness : 40 Shore00, Test Method ASTM D2240
- Color : Grey
- Thickness (mm) : 0.5-5, Test Method ASTM D374
- Thermal Impedance : 0.94 °C·in²/W, 1 mm at 10 psi, Typical Value, Test Method ASTM D5470
- Volume Resistivity : 2.0x1013 ohm-cm, Test Method ASTM D257
- Dielectric Constant : 5.5 at 1MHz, Test Method ASTM D150
- Flammability : V-0, Test Method UL94
- Typical Uses : Consumer electronics|Power devices & modules|Semiconductor logic & memory|Telecommunications & network servers
- Key Features : Cost effectiveness
- Application : High Compressibility