Silicon Etchants
Defreckle Etch 2 (17565)
Puranal
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Overview
Specifications
General Information
- Application
- Etchants
- CAS Number
- No data available
- Grade
- SEMI
- SemEG
- Synonyms
- Etchant
Physical Properties
- Boiling Point/Range
- > 100 °C (1,013 hPa)
- Color
- Colorless
- Density
- 1.59 g/cm3 (20 °C)
- Flashpoint
- Not applicable
- Melting Point/Range
- No data available
- Odor
- Vinegar-Like
- pH
- Acidic
- Physical Form
- Liquid
- Solubility in Water
- Completely miscible
Safety Information
- Chemical Stability
- No data available
- Corrosivity
- Corrosive to metals
- Ignition Temperature
- Not applicable
- Incompatible Materials
- Corrosive in contact with metals, Glass and silicate-containing materials are attacked, Reactions with organic substances
- Thermal Decomposition
- Fire or intense heat may cause violent rupture of packages.
International Transportation
- Chemical Class
- 8
- Harmonized System Code
- 38249996
- Packing Group
- II
- Sub Class 1
- 6.1
- UN Number
- 2922
General Information
- Application
- Etchants
- CAS Number
- No data available
- Grade
- SEMI
- SemEG
- Synonyms
- Etchant
Physical Properties
- Boiling Point/Range
- > 100 °C (1,013 hPa)
- Color
- Colorless
- Density
- 1.59 g/cm3 (20 °C)
- Flashpoint
- Not applicable
- Melting Point/Range
- No data available
- Odor
- Vinegar-Like
- pH
- Acidic
- Physical Form
- Liquid
- Solubility in Water
- Completely miscible
Safety Information
- Chemical Stability
- No data available
- Corrosivity
- Corrosive to metals
- Ignition Temperature
- Not applicable
- Incompatible Materials
- Corrosive in contact with metals, Glass and silicate-containing materials are attacked, Reactions with organic substances
- Thermal Decomposition
- Fire or intense heat may cause violent rupture of packages.
International Transportation
- Chemical Class
- 8
- Harmonized System Code
- 38249996
- Packing Group
- II
- Sub Class 1
- 6.1
- UN Number
- 2922
- CAS Number : No data available
- Grade : SEMI|SemEG
- Application : Etchants
- Synonyms : Etchant
- Physical Form : Liquid
- Melting Point/Range : No data available
- Color : Colorless
- Solubility in Water : Completely miscible
- Odor : Vinegar-Like
- Flashpoint : Not applicable
- Density : 1.59 g/cm3 (20 °C)
- Boiling Point/Range : > 100 °C (1,013 hPa)
- pH : Acidic
- Chemical Stability : No data available
- Incompatible Materials : Corrosive in contact with metals, Glass and silicate-containing materials are attacked, Reactions with organic substances
- Ignition Temperature : Not applicable
- Thermal Decomposition : Fire or intense heat may cause violent rupture of packages.
- Corrosivity : Corrosive to metals
- Packing Group : II
- Sub Class 1 : 6.1
- Chemical Class : 8
- UN Number : 2922
- Harmonized System Code : 38249996
Sales Sheet
Name
Description
File Size
Date
Size
Texture Etch-wafer thinning materials
application/pdf 961.5 KB
10/31/2023
961.5 KB
Name
Description
File Size
Date
Size
Texture Etch-wafer thinning materials
application/pdf 961.5 KB
10/31/2023
961.5 KB
Name
Description
File Size
Date
Size
Texture Etch-wafer thinning materials
961.5 KB
10/31/2023