Thermal One-Part Hybrids
HT4500
Thermal conductivity liquid gap fillers have the benefits of shape recovery, strong material cohesion, and good long-term thermal stability — they also offer a very low thermal resistance comparable to thermal grease, and can fill gaps at interfaces.
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Overview
One-Part Dispensable Very Low Compression ForceThermal conductivity liquid gap fillers not only have the benefits of shape recovery, strong material cohesion, and good long-term thermal stability — they also offer a very low thermal resistance comparable to thermal grease, and can fill gaps at interfaces. Hybrid is a substance between liquid and solid, combining the advantages of thermal grease and thermal gap pad.
Typical Applications
Typical Applications
- Consumer electronics
- Telecommunications equipment
- Automotive electronics
- Power supplies & semiconductors
- Memory & power modules
- Power electronics Features
- High thermal performance and low contact resistance
- Easily dispensable and reworkable
- High compressibility for low stress applications Long-term reliability
- No pump-out or cracking risk
- Reduced oil separation
- Requires no mixing, additional curing or low temperature storage
Specifications
Thermal Properties
- Thermal Conductivity
- 4.5 W/m-K, Test Method, ASTM D5470
Physical Properties
- Bond-Line Thickness (BLT)
- 0.06 mm
- Color
- Green
- Dispense Rate
- >40 g/min, Test Method 90psi, 30cc EFD syringe
- Shelf Life
- 6 months Year
- Specific Gravity
- 3.3, Test Method ASTM D792
- Format
- Liquid
Electrical Properties
- Volume Resistivity
- >1.0X1013 ohm-cm, Test Method ASTM D257
General Information
- Application
- Automation
- Gap Filler
- Key Features
- Pre-cured
- Printable
- Typical Uses
- Consumer electronics
- Memory & power modules
- Power electronics
- Power supplies
- Telecommunications equipment
- Storage Temperature
- Room Temperature
- Industry
- Automotive
- Consumer Electronics
- Technology and Telecommunications
Other
- Other Notes
- Available in 280cc aluminum cartridge, 1 gallon pail and 5 gallon pail
Thermal Properties
- Thermal Conductivity
- 4.5 W/m-K, Test Method, ASTM D5470
Physical Properties
- Bond-Line Thickness (BLT)
- 0.06 mm
- Color
- Green
- Dispense Rate
- >40 g/min, Test Method 90psi, 30cc EFD syringe
- Shelf Life
- 6 months Year
- Specific Gravity
- 3.3, Test Method ASTM D792
- Format
- Liquid
Electrical Properties
- Volume Resistivity
- >1.0X1013 ohm-cm, Test Method ASTM D257
General Information
- Application
- Automation
- Gap Filler
- Key Features
- Pre-cured
- Printable
- Typical Uses
- Consumer electronics
- Memory & power modules
- Power electronics
- Power supplies
- Telecommunications equipment
- Storage Temperature
- Room Temperature
- Industry
- Automotive
- Consumer Electronics
- Technology and Telecommunications
Other
- Other Notes
- Available in 280cc aluminum cartridge, 1 gallon pail and 5 gallon pail
- Thermal Conductivity : 4.5 W/m-K, Test Method, ASTM D5470
- Specific Gravity : 3.3, Test Method ASTM D792
- Shelf Life : 6 months Year
- Format : Liquid
- Dispense Rate : >40 g/min, Test Method 90psi, 30cc EFD syringe
- Color : Green
- Bond-Line Thickness (BLT) : 0.06 mm
- Volume Resistivity : >1.0X1013 ohm-cm, Test Method ASTM D257
- Application : Automation|Gap Filler
- Typical Uses : Consumer electronics|Memory & power modules|Power electronics|Power supplies|Telecommunications equipment
- Storage Temperature : Room Temperature
- Key Features : Pre-cured|Printable
- Industry : Automotive|Consumer Electronics|Technology and Telecommunications
- Other Notes : Available in 280cc aluminum cartridge, 1 gallon pail and 5 gallon pail
Brochure
Name
Description
File Size
Date
Size
Thermal Interface Materials Electronics Brochure
application/pdf 821.77 KB
8/7/2025
821.77 KB
Data Sheet
Name
Description
File Size
Date
Size
HT4500 - Thermally Conductive Gap Filler
application/pdf 42.75 KB
10/31/2023
42.75 KB
Name
Description
File Size
Date
Size
HT4500 - Thermally Conductive Gap Filler
application/pdf 42.75 KB
10/31/2023
42.75 KB
Thermal Interface Materials Electronics Brochure
application/pdf 821.77 KB
8/7/2025
821.77 KB
Name
Description
File Size
Date
Size
Thermal Interface Materials Electronics Brochure
821.77 KB
8/7/2025
HT4500 - Thermally Conductive Gap Filler
42.75 KB
10/31/2023