Thermal One-Part Hybrids
HT3500
Honeywell HT series products are precured one component, made of cross-linked silicone w/ceramic particles, dispensable and reworkable, high compressibility for low stress applications, no mixing, and additional curing or low temp storage (3.5 W/m·K)
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Overview
One-Part Dispensable Very Low Compression Force Thermal conductivity liquid gap fillers not only have the benefits of shape recovery, strong material cohesion, and good long-term thermal stability — they also offer a very low thermal resistance comparable to thermal grease, and can fill gaps at interfaces. Hybrid is a substance between liquid and solid, combining the advantages of thermal grease and thermal gap pad.
Typical Applications
• Consumer electronics
• Telecommunications equipment
• Automotive electronics
• Power supplies & semiconductors
• Memory & power modules
• Power electronics
Features
• High thermal performance and low contact resistance
• Easily dispensable and reworkable
• High compressibility for low stress applications
• Long-term reliability
• No pump-out or cracking risk
• Reduced oil separation
• Requires no mixing, additional curing or low temperature storage
Typical Applications
• Consumer electronics
• Telecommunications equipment
• Automotive electronics
• Power supplies & semiconductors
• Memory & power modules
• Power electronics
Features
• High thermal performance and low contact resistance
• Easily dispensable and reworkable
• High compressibility for low stress applications
• Long-term reliability
• No pump-out or cracking risk
• Reduced oil separation
• Requires no mixing, additional curing or low temperature storage
Specifications
Thermal Properties
- Thermal Conductivity
- 3.5 W/m-K, Test Method ASTM D5470
- Thermal Impedance
- <0.35 °C·cm²/W, Test Method ASTM D5470 at BLT
Physical Properties
- Bond-Line Thickness (BLT)
- 0.10 mm
- Color
- Dark Red
- Dispense Rate
- >10 g/min, Test Method 90psi, 30cc EFD syringe
- Outgassing
- <0.5%, Test Method ASTM E595 (TML)
- Shelf Life
- 6 months Year
- Specific Gravity
- 3.2, Test Method ASTM D792
- Format
- Liquid
General Information
- Application
- Automation
- Gap Filler
- Key Features
- Cost Effectiveness
- Pre-cured
- Typical Uses
- Consumer electronics
- Memory & power modules
- Power electronics
- Power supplies
- Telecommunications equipment
- Storage Temperature
- Room Temperature
- Industry
- Automotive
- Consumer Electronics
- Technology and Telecommunications
Other
- Other Notes
- Available in 280cc aluminum cartridge, 1 gallon pail and 5 gallon pail
Thermal Properties
- Thermal Conductivity
- 3.5 W/m-K, Test Method ASTM D5470
- Thermal Impedance
- <0.35 °C·cm²/W, Test Method ASTM D5470 at BLT
Physical Properties
- Bond-Line Thickness (BLT)
- 0.10 mm
- Color
- Dark Red
- Dispense Rate
- >10 g/min, Test Method 90psi, 30cc EFD syringe
- Outgassing
- <0.5%, Test Method ASTM E595 (TML)
- Shelf Life
- 6 months Year
- Specific Gravity
- 3.2, Test Method ASTM D792
- Format
- Liquid
General Information
- Application
- Automation
- Gap Filler
- Key Features
- Cost Effectiveness
- Pre-cured
- Typical Uses
- Consumer electronics
- Memory & power modules
- Power electronics
- Power supplies
- Telecommunications equipment
- Storage Temperature
- Room Temperature
- Industry
- Automotive
- Consumer Electronics
- Technology and Telecommunications
Other
- Other Notes
- Available in 280cc aluminum cartridge, 1 gallon pail and 5 gallon pail
- Thermal Impedance : <0.35 °C·cm²/W, Test Method ASTM D5470 at BLT
- Thermal Conductivity : 3.5 W/m-K, Test Method ASTM D5470
- Specific Gravity : 3.2, Test Method ASTM D792
- Shelf Life : 6 months Year
- Outgassing : <0.5%, Test Method ASTM E595 (TML)
- Format : Liquid
- Dispense Rate : >10 g/min, Test Method 90psi, 30cc EFD syringe
- Color : Dark Red
- Bond-Line Thickness (BLT) : 0.10 mm
- Application : Automation|Gap Filler
- Typical Uses : Consumer electronics|Memory & power modules|Power electronics|Power supplies|Telecommunications equipment
- Storage Temperature : Room Temperature
- Key Features : Cost Effectiveness|Pre-cured
- Industry : Automotive|Consumer Electronics|Technology and Telecommunications
- Other Notes : Available in 280cc aluminum cartridge, 1 gallon pail and 5 gallon pail
Brochure
Name
Description
File Size
Date
Size
Thermal Interface Materials Electronics Brochure
application/pdf 821.77 KB
8/7/2025
821.77 KB
Data Sheet
Name
Description
File Size
Date
Size
Thermal One-Part Hybrid: HT3500 - HT5000
application/pdf 57.29 KB
8/11/2025
57.29 KB
Name
Description
File Size
Date
Size
Thermal One-Part Hybrid: HT3500 - HT5000
application/pdf 57.29 KB
8/11/2025
57.29 KB
Thermal Interface Materials Electronics Brochure
application/pdf 821.77 KB
8/7/2025
821.77 KB
Name
Description
File Size
Date
Size
Thermal Interface Materials Electronics Brochure
821.77 KB
8/7/2025
Thermal One-Part Hybrid: HT3500 - HT5000
57.29 KB
8/11/2025