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Silicon Etchants

Nitric Acid Etching Mixture (81104)

SEF 555-223-222, VLSI

Overview
Specifications

General Information

  • Application
    • Etchants
  • CAS Number
    • 7697-37-2
  • Grade
    • VLSI
  • Synonyms
    • Etchant

Physical Properties

  • Boiling Point/Range
    • No data available
  • Color
    • Colorless
  • Density
    • 1.280 g/cm3 (20 °C)
  • Flashpoint
    • Not applicable
  • Melting Point/Range
    • No data available
  • Odor
    • Stinging
  • Physical Form
    • Liquid
  • Solubility in Water
    • Completely miscible

Safety Information

  • Chemical Stability
    • No data available
  • Corrosivity
    • Corrosive to metals
  • Ignition Temperature
    • Not applicable
  • Incompatible Materials
    • Reactions with combustible substances, Glass and silicate-containing materials are attacked, Hydrogen by reaction with metals
  • Thermal Decomposition
    • To avoid thermal decomposition, do not overheat.

International Transportation

  • Chemical Class
    • 8
  • Harmonized System Code
    • 38249996
  • Packing Group
    • II
  • Sub Class 1
    • 6.1
  • UN Number
    • 2922

General Information

  • Application
    • Etchants
  • CAS Number
    • 7697-37-2
  • Grade
    • VLSI
  • Synonyms
    • Etchant

Physical Properties

  • Boiling Point/Range
    • No data available
  • Color
    • Colorless
  • Density
    • 1.280 g/cm3 (20 °C)
  • Flashpoint
    • Not applicable
  • Melting Point/Range
    • No data available
  • Odor
    • Stinging
  • Physical Form
    • Liquid
  • Solubility in Water
    • Completely miscible

Safety Information

  • Chemical Stability
    • No data available
  • Corrosivity
    • Corrosive to metals
  • Ignition Temperature
    • Not applicable
  • Incompatible Materials
    • Reactions with combustible substances, Glass and silicate-containing materials are attacked, Hydrogen by reaction with metals
  • Thermal Decomposition
    • To avoid thermal decomposition, do not overheat.

International Transportation

  • Chemical Class
    • 8
  • Harmonized System Code
    • 38249996
  • Packing Group
    • II
  • Sub Class 1
    • 6.1
  • UN Number
    • 2922
  • Grade : VLSI
  • CAS Number : 7697-37-2
  • Synonyms : Etchant
  • Application : Etchants
  • Odor : Stinging
  • Flashpoint : Not applicable
  • Melting Point/Range : No data available
  • Solubility in Water : Completely miscible
  • Density : 1.280 g/cm3 (20 °C)
  • Boiling Point/Range : No data available
  • Physical Form : Liquid
  • Color : Colorless
  • Chemical Stability : No data available
  • Thermal Decomposition : To avoid thermal decomposition, do not overheat.
  • Ignition Temperature : Not applicable
  • Corrosivity : Corrosive to metals
  • Incompatible Materials : Reactions with combustible substances, Glass and silicate-containing materials are attacked, Hydrogen by reaction with metals
  • Chemical Class : 8
  • Harmonized System Code : 38249996
  • UN Number : 2922
  • Sub Class 1 : 6.1
  • Packing Group : II
Sales Sheet
Name
Description
File Size
Date
Size
Texture Etch-wafer thinning materials
application/pdf 961.5 KB
10/31/2023
961.5 KB
Name
Description
File Size
Date
Size
Texture Etch-wafer thinning materials
application/pdf 961.5 KB
10/31/2023
961.5 KB
Name
Description
File Size
Date
Size
Texture Etch-wafer thinning materials
961.5 KB
10/31/2023