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Silicon Etchants

Nitric Acid Etching Mixture (17764)

SPF 64(65)-19-17(40) MOS Puranal

Overview
Specifications

General Information

  • Grade
    • SemEG
  • Synonyms
    • Etchant
    • Hydrogen Nitrate

Physical Properties

  • Boiling Point/Range
    • > 100 °C (1,013 hPa)
  • Color
    • Colorless
  • Density
    • 1.410 g/cm3 (20 °C)
  • Flashpoint
    • Not applicable
  • Melting Point/Range
    • No data available
  • Odor
    • Stinging
  • pH
    • Acidic
  • Physical Form
    • Liquid
  • Solubility in Water
    • Completely miscible

Safety Information

  • Corrosivity
    • Corrosive to metals
  • Ignition Temperature
    • Not applicable
  • Incompatible Materials
    • Corrosive in contact with metals, Glass and silicate-containing materials are attacked
  • Thermal Decomposition
    • No decomposition if used as directed.

International Transportation

  • Chemical Class
    • 8
  • Harmonized System Code
    • 38249996
  • Packing Group
    • II
  • Sub Class 1
    • 6.1
  • UN Number
    • 2922

General Information

  • Grade
    • SemEG
  • Synonyms
    • Etchant
    • Hydrogen Nitrate

Physical Properties

  • Boiling Point/Range
    • > 100 °C (1,013 hPa)
  • Color
    • Colorless
  • Density
    • 1.410 g/cm3 (20 °C)
  • Flashpoint
    • Not applicable
  • Melting Point/Range
    • No data available
  • Odor
    • Stinging
  • pH
    • Acidic
  • Physical Form
    • Liquid
  • Solubility in Water
    • Completely miscible

Safety Information

  • Corrosivity
    • Corrosive to metals
  • Ignition Temperature
    • Not applicable
  • Incompatible Materials
    • Corrosive in contact with metals, Glass and silicate-containing materials are attacked
  • Thermal Decomposition
    • No decomposition if used as directed.

International Transportation

  • Chemical Class
    • 8
  • Harmonized System Code
    • 38249996
  • Packing Group
    • II
  • Sub Class 1
    • 6.1
  • UN Number
    • 2922
  • Grade : SemEG
  • Synonyms : Etchant|Hydrogen Nitrate
  • Flashpoint : Not applicable
  • Physical Form : Liquid
  • Boiling Point/Range : > 100 °C (1,013 hPa)
  • pH : Acidic
  • Solubility in Water : Completely miscible
  • Melting Point/Range : No data available
  • Density : 1.410 g/cm3 (20 °C)
  • Odor : Stinging
  • Color : Colorless
  • Incompatible Materials : Corrosive in contact with metals, Glass and silicate-containing materials are attacked
  • Corrosivity : Corrosive to metals
  • Ignition Temperature : Not applicable
  • Thermal Decomposition : No decomposition if used as directed.
  • UN Number : 2922
  • Harmonized System Code : 38249996
  • Sub Class 1 : 6.1
  • Packing Group : II
  • Chemical Class : 8
Sales Sheet
Name
Description
File Size
Date
Size
Texture Etch-wafer thinning materials
application/pdf 961.5 KB
10/31/2023
961.5 KB
Name
Description
File Size
Date
Size
Texture Etch-wafer thinning materials
application/pdf 961.5 KB
10/31/2023
961.5 KB
Name
Description
File Size
Date
Size
Texture Etch-wafer thinning materials
961.5 KB
10/31/2023