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High Purity Evaporation Materials

Metals for dieback metallization and underbump metallurgy (UBM ) for flip chip applications.

Evaporation slug

Aluminum (Al)

Au 0.5Ge, Au 2Ge, Au12Ge

Au 2Si, Au 3.1Si

Evaporation slug

Copper (Cu)

Gold (Au)

Evaporation slug

Silver (Ag)

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High Purity Evaporation Materials

Aluminum (Al)

Au 0.5Ge, Au 2Ge, Au12Ge

Au 2Si, Au 3.1Si

Copper (Cu)

Gold (Au)

Silver (Ag)

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