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Advanced Materials
Electronic Materials
Maintain your competitive edge with Honeywell Electronic Materials’ sputtering targets for the semiconductor industry, our pioneering spin on glass (SOG) microelectronic polymer technology, Low Alpha phase change material such as Honeywell T11, HCL chemicals, and more. As part of Honeywell, we share in the strength, resources and best practices of one of the world’s leading corporations. We invest in innovation and hold nearly 400 granted and pending patents. Our three major centers dedicated to research and development are in Sunnyvale, California; Spokane, Washington; and Shanghai, China. We are committed to evolving our quality disciplines to ensure that we exceed customer requirements.
Honeywell Electronic Materials
Maintain your competitive edge with Honeywell Electronic Materials’ sputtering targets for the semiconductor industry, our pioneering spin on glass (SOG) microelectronic polymer technology, Low Alpha phase change material such as Honeywell T11, HCL chemicals, and more.
As part of Honeywell, we share in the strength, resources and best practices of one of the world’s leading corporations. We invest in innovation and hold nearly 400 granted and pending patents. Our three major centers dedicated to research and development are in Sunnyvale, California; Spokane, Washington; and Shanghai, China. We are committed to evolving our quality disciplines to ensure that we exceed customer requirements.
Featured applications
Semiconductor Manufacturing
Electronic materials for the semiconductor industry
Automotive
Thermal Interface Materials (TIMs) for Power Control Units (PCUs), converters, inverters, onboard electronics, electric vehicles/hybrid vehicles and batteries.
Thermal Management
Thermal Interface Materials (TIMs) for Power Control Units (PCUs), converters, inverters, onboard electronics, electric vehicles/hybrid vehicles and batteries.
Consumer Electronics
Our Thermal Interface Materials offer cost-effective thermal filler gap pads and grease, heat transfer paste, gap filler and phase change materials to eliminate air gaps and reduce localized areas of high thermal resistance.
- Phase Change Materials (PCM) are designed to minimize thermal resistance at interfaces and maintain stable performance through the rigorous reliability testing required for long product life applications.
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