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Phase Change Materials

PTM7000

PTM7000 is a Phase Change Pad with a Thermal Impedance of 0.04 - 0.07 (OC cm²/w), Thermal Conductivity of 6.5 (w/mk) and Specific Gravity of 2.7 (g/cm³)

Overview
PTM7000 is designed to minimize thermal resistance at interfaces and maintain extremely stable performance through reliability testing, which is required for long product life applications. Like all phase change materials, it has stable thermal impedance across accelerated aging tests and does not display bleeding, pumping, or flow out.PTM7000 has a thermal conductivity of 6.5 (W/m·K) depending on the bondline thickness. It is based on a robust polymer PCM structure that exhibits excellent wetting properties during typical operating temperature ranges, resulting in very low surface contact resistance. The usual temperature range is -40°C to 125°C. This proprietary material provides superior reliability and maintains low thermal impedance (0.06), making it desirable for high-performance integrated circuit devices. Regarding breakdown voltage, phase change materials are typically around 5000V/mm, which is highly thickness-dependent.  An initial "unphased" 0.2mm pad will have a different BV than the final 30/40um bondline.
Specifications

Physical Properties

  • Color
    • Light Blue
  • Shelf Life
    • 12 months Year
  • Specific Gravity
    • 2.7, Test Method ASTM D374
  • Thickness (mm)
    • 0.2 / 0.25 / 0.3 / 0.4 / 0.5
  • Format
    • Pad

Thermal Properties

  • Thermal Conductivity
    • 6.5
  • Thermal Impedance
    • 0.04-0.07

Electrical Properties

  • Volume Resistivity
    • 2.1x1014 ohm-cm, Test Method ASTM D259

General Information

  • Application
    • ADAS
    • Inverter
    • Networks
  • Key Features
    • High Reliability
    • Low TI
  • Typical Uses
    • IGBT
    • Lighting
    • Power control unit, inverter, onboard electronics
    • Servers, supercomputing, video graphic array (VGA) cards, AI, GPU/CPU/Desktop, solid state drives (SSD)
    • Switches, routers, base stations
    • Tablets, gaming, notebooks, smartphones, action cameras
  • Industry
    • Auto Electronics/EV
    • Auto Electronics/EV
    • Telecom/Data Center

Physical Properties

  • Color
    • Light Blue
  • Shelf Life
    • 12 months Year
  • Specific Gravity
    • 2.7, Test Method ASTM D374
  • Thickness (mm)
    • 0.2 / 0.25 / 0.3 / 0.4 / 0.5
  • Format
    • Pad

Thermal Properties

  • Thermal Conductivity
    • 6.5
  • Thermal Impedance
    • 0.04-0.07

Electrical Properties

  • Volume Resistivity
    • 2.1x1014 ohm-cm, Test Method ASTM D259

General Information

  • Application
    • ADAS
    • Inverter
    • Networks
  • Key Features
    • High Reliability
    • Low TI
  • Typical Uses
    • IGBT
    • Lighting
    • Power control unit, inverter, onboard electronics
    • Servers, supercomputing, video graphic array (VGA) cards, AI, GPU/CPU/Desktop, solid state drives (SSD)
    • Switches, routers, base stations
    • Tablets, gaming, notebooks, smartphones, action cameras
  • Industry
    • Auto Electronics/EV
    • Auto Electronics/EV
    • Telecom/Data Center
  • Specific Gravity : 2.7, Test Method ASTM D374
  • Shelf Life : 12 months Year
  • Color : Light Blue
  • Thermal Conductivity : 6.5
  • Thickness (mm) : 0.2 / 0.25 / 0.3 / 0.4 / 0.5
  • Thermal Impedance : 0.04-0.07
  • Volume Resistivity : 2.1x1014 ohm-cm, Test Method ASTM D259
  • Format : Pad
  • Application : ADAS|Inverter|Networks
  • Key Features : High Reliability|Low TI
  • Industry : Auto Electronics/EV|Auto Electronics/EV|Telecom/Data Center
  • Typical Uses : IGBT|Lighting|Power control unit, inverter, onboard electronics|Servers, supercomputing, video graphic array (VGA) cards, AI, GPU/CPU/Desktop, solid state drives (SSD)|Switches, routers, base stations|Tablets, gaming, notebooks, smartphones, action cameras
Brochure
Name
Description
File Size
Date
Size
Thermal Interface Materials Electronics Brochure
application/pdf 820.98 KB
10/31/2023
820.98 KB
879055 ADM FLR TIMs LTR
application/pdf 73.46 KB
10/31/2023
73.46 KB
Name
Description
File Size
Date
Size
Thermal Interface Materials Electronics Brochure
application/pdf 820.98 KB
10/31/2023
820.98 KB
879055 ADM FLR TIMs LTR
application/pdf 73.46 KB
10/31/2023
73.46 KB
Name
Description
File Size
Date
Size
Thermal Interface Materials Electronics Brochure
820.98 KB
10/31/2023
879055 ADM FLR TIMs LTR
73.46 KB
10/31/2023