Phase Change Materials
LTM Series
Phase Change Materials (PCM) are often used as matrix materials for thermal interface applications with providing a thin bond line and high reliability without pump-out issues. (1.8-2.4 W/m-K)
Overview
Phase change materials (PCM) are often used as matrix materials for thermal interface applications, because they are solid at room temperature, and soften when heated. They can fully fill the gaps of contact surfaces, therefore providing a thin bond line and high reliability without pump-out issues.Typical Applications• Power control unit, inverter, onboard electronics• IGBT• Servers, supercomputing, video graphic array (VGA) cards, AI, GPU/CPU/Desktop, solid state drives (SSD)• Switches, routers, base stations• Tablets, gaming, notebooks, smartphones, action cameras• LightingFeatures• High performance filler and polymer technology• Phase change at 45 ˚C• Highly conductive filler loading to optimize performance• Superior handling and rework ability• Superior reliable thermal performance• Range of thermal properties to fit different needs
Specifications
Physical Properties
- Shelf Life
- 12 months Year
- Specific Gravity
- 1.8, Test Method ASTM D374
- Thickness (mm)
- N/A
Thermal Properties
- Thermal Conductivity
- 1.8-2.4 W/m-K, Test Method ASTM D5470
- Thermal Impedance
- 0.12-0.14 at no shim °C·cm²/W, Test Method ASTM D5470 Modified
Electrical Properties
- Volume Resistivity
- 3.0x1015 ohm-cm, Test Method ASTM D257
General Information
- Application
- High Reliability
- Key Features
- Paste Only
- Typical Uses
- IGBT
- Lighting
- Power control unit, inverter, onboard electronics
- Servers, supercomputing, video graphic array (VGA) cards, AI, GPU/CPU/Desktop, solid state drives (SSD)
- Switches, routers, base stations
- Tablets, gaming, notebooks, smartphones, action cameras
Physical Properties
- Shelf Life
- 12 months Year
- Specific Gravity
- 1.8, Test Method ASTM D374
- Thickness (mm)
- N/A
Thermal Properties
- Thermal Conductivity
- 1.8-2.4 W/m-K, Test Method ASTM D5470
- Thermal Impedance
- 0.12-0.14 at no shim °C·cm²/W, Test Method ASTM D5470 Modified
Electrical Properties
- Volume Resistivity
- 3.0x1015 ohm-cm, Test Method ASTM D257
General Information
- Application
- High Reliability
- Key Features
- Paste Only
- Typical Uses
- IGBT
- Lighting
- Power control unit, inverter, onboard electronics
- Servers, supercomputing, video graphic array (VGA) cards, AI, GPU/CPU/Desktop, solid state drives (SSD)
- Switches, routers, base stations
- Tablets, gaming, notebooks, smartphones, action cameras
- Shelf Life : 12 months Year
- Thermal Conductivity : 1.8-2.4 W/m-K, Test Method ASTM D5470
- Thermal Impedance : 0.12-0.14 at no shim °C·cm²/W, Test Method ASTM D5470 Modified
- Specific Gravity : 1.8, Test Method ASTM D374
- Thickness (mm) : N/A
- Volume Resistivity : 3.0x1015 ohm-cm, Test Method ASTM D257
- Typical Uses : IGBT|Lighting|Power control unit, inverter, onboard electronics|Servers, supercomputing, video graphic array (VGA) cards, AI, GPU/CPU/Desktop, solid state drives (SSD)|Switches, routers, base stations|Tablets, gaming, notebooks, smartphones, action cameras
- Key Features : Paste Only
- Application : High Reliability
Others
Name
Description
File Size
Date
Size
Phase Change Materials: LTM6300 - PCM45F -PTM5000
application/pdf 64.53 KB
10/31/2023
64.53 KB
Brochure
Name
Description
File Size
Date
Size
Thermal Interface Materials Electronics Brochure
application/pdf 820.98 KB
10/31/2023
820.98 KB
Name
Description
File Size
Date
Size
Phase Change Materials: LTM6300 - PCM45F -PTM5000
64.53 KB
10/31/2023
64.53 KB
Thermal Interface Materials Electronics Brochure
820.98 KB
10/31/2023
820.98 KB
Name
Description
File Size
Date
Size
Phase Change Materials: LTM6300 - PCM45F -PTM5000
64.53 KB
10/31/2023
Thermal Interface Materials Electronics Brochure
820.98 KB
10/31/2023
