Patterning Materials
ACCUFLO® T-27
Sacraficial Fill Material
Overview
The patented ACCUFLO T-27 Series is a family of organic polymers formulated in an environmental friendly solvent system designed to fill and planarize a wide spectrum of aggressive topographies.The ACCUFLO T-27 Series offers excellent void-free fill capability and superior local, regional and global planarization of ultra deep sub-micron features with an aspect ratio exceeding 60:1. The performance advantages offered by ACCUFLO T-27 films include improved thermal stability, reduced viscosity and reduced inter-facial surface tension to enhance coating properties.
Specifications
General Information
- Application
- Feature Fill and Masking
- Total Etch Back Planarization
- Benefits
- Ease of integration — uses known technology and current tool sets
- Excellent cost of ownership
- Industry accepted safe solvent with high flashpoint
- Industry proven technology
- Reduced viscosity and surface tension to enhance coating
- Room temperature storage
- Superior melt reflow for planarization and feature fill
- Brand
- Honeywell
General Information
- Application
- Feature Fill and Masking
- Total Etch Back Planarization
- Benefits
- Ease of integration — uses known technology and current tool sets
- Excellent cost of ownership
- Industry accepted safe solvent with high flashpoint
- Industry proven technology
- Reduced viscosity and surface tension to enhance coating
- Room temperature storage
- Superior melt reflow for planarization and feature fill
- Brand
- Honeywell
- Brand : Honeywell
- Application : Feature Fill and Masking|Total Etch Back Planarization
- Benefits : Ease of integration — uses known technology and current tool sets|Excellent cost of ownership|Industry accepted safe solvent with high flashpoint|Industry proven technology|Reduced viscosity and surface tension to enhance coating|Room temperature storage|Superior melt reflow for planarization and feature fill
Sell Sheet
Name
Description
File Size
Date
Size
Family of organic polymers for fill and planarization of aggressive topographies
application/pdf 520.01 KB
10/31/2023
520.01 KB
Name
Description
File Size
Date
Size
Family of organic polymers for fill and planarization of aggressive topographies
520.01 KB
10/31/2023
520.01 KB
Name
Description
File Size
Date
Size
Family of organic polymers for fill and planarization of aggressive topographies
520.01 KB
10/31/2023
