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Silicon Etchants

Nitric Acid Etching Mixture SF (17242)

90(65)-10(40), Puranal

Overview
Specifications

Others

  • Grade
    • SemEG
  • pH
    • Acidic
  • Melting Point/Range
    • No data available
  • Boiling Point/Range
    • 100 °C (1,013 mbar)
  • Physical Form
    • Liquid
  • Flashpoint
    • Not applicable
  • Density
    • 1.37 g/cm3
  • Color
    • Colorless
  • Odor
    • Stinging
  • Incompatible Materials
    • Evolution of toxic gases/vapours, Hydrogen by reaction with metals, Glass and silicate-containing materials are attacked
  • Thermal Decomposition
    • To avoid thermal decomposition, do not overheat.
  • Corrosivity
    • Corrosive to metals
  • Harmonized System Code
    • 38249996
  • Chemical Class
    • 8
  • Packing Group
    • II
  • Sub Class 1
    • 6.1
  • UN Number
    • 2922

Others

  • Grade
    • SemEG
  • pH
    • Acidic
  • Melting Point/Range
    • No data available
  • Boiling Point/Range
    • 100 °C (1,013 mbar)
  • Physical Form
    • Liquid
  • Flashpoint
    • Not applicable
  • Density
    • 1.37 g/cm3
  • Color
    • Colorless
  • Odor
    • Stinging
  • Incompatible Materials
    • Evolution of toxic gases/vapours, Hydrogen by reaction with metals, Glass and silicate-containing materials are attacked
  • Thermal Decomposition
    • To avoid thermal decomposition, do not overheat.
  • Corrosivity
    • Corrosive to metals
  • Harmonized System Code
    • 38249996
  • Chemical Class
    • 8
  • Packing Group
    • II
  • Sub Class 1
    • 6.1
  • UN Number
    • 2922
  • Grade : SemEG
  • pH : Acidic
  • Melting Point/Range : No data available
  • Boiling Point/Range : 100 °C (1,013 mbar)
  • Physical Form : Liquid
  • Flashpoint : Not applicable
  • Density : 1.37 g/cm3
  • Color : Colorless
  • Odor : Stinging
  • Incompatible Materials : Evolution of toxic gases/vapours, Hydrogen by reaction with metals, Glass and silicate-containing materials are attacked
  • Thermal Decomposition : To avoid thermal decomposition, do not overheat.
  • Corrosivity : Corrosive to metals
  • Harmonized System Code : 38249996
  • Chemical Class : 8
  • Packing Group : II
  • Sub Class 1 : 6.1
  • UN Number : 2922
Sales Sheet
Name
Description
File Size
Date
Size
Texture Etch-wafer thinning materials
application/pdf 961.61 KB
9/7/2022
961.61 KB
Name
Description
File Size
Date
Size
Texture Etch-wafer thinning materials
961.61 KB
9/7/2022
961.61 KB
Name
Description
File Size
Date
Size
Texture Etch-wafer thinning materials
961.61 KB
9/7/2022
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