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Silicon Etchants

Nitric Acid Etching Mixture SF (17242)

90(65)-10(40), Puranal

Physical Properties

  • Melting Point/Range
    • No data available
  • Physical Form
    • Liquid
  • Boiling Point/Range
    • 100 °C (1,013 mbar)
  • Flashpoint
    • Not applicable
  • Color
    • Colorless
  • Odor
    • Stinging
  • pH
    • Acidic

Safety Information

  • Corrosivity
    • Corrosive to metals
  • Incompatible Materials
    • Evolution of toxic gases/vapours, Hydrogen by reaction with metals, Glass and silicate-containing materials are attacked
  • Thermal Decomposition
    • To avoid thermal decomposition, do not overheat.

International Transportation

  • Chemical Class
    • 8
  • Packing Group
    • II
  • UN Number
    • 2922
  • Harmonized System Code
    • 38249996
  • Sub Class 1
    • 6.1

Physical Properties

  • Melting Point/Range
    • No data available
  • Physical Form
    • Liquid
  • Boiling Point/Range
    • 100 °C (1,013 mbar)
  • Flashpoint
    • Not applicable
  • Color
    • Colorless
  • Odor
    • Stinging
  • pH
    • Acidic

Safety Information

  • Corrosivity
    • Corrosive to metals
  • Incompatible Materials
    • Evolution of toxic gases/vapours, Hydrogen by reaction with metals, Glass and silicate-containing materials are attacked
  • Thermal Decomposition
    • To avoid thermal decomposition, do not overheat.

International Transportation

  • Chemical Class
    • 8
  • Packing Group
    • II
  • UN Number
    • 2922
  • Harmonized System Code
    • 38249996
  • Sub Class 1
    • 6.1
  • Melting Point/Range : No data available
  • Physical Form : Liquid
  • Boiling Point/Range : 100 °C (1,013 mbar)
  • Flashpoint : Not applicable
  • Color : Colorless
  • Odor : Stinging
  • pH : Acidic
  • Corrosivity : Corrosive to metals
  • Incompatible Materials : Evolution of toxic gases/vapours, Hydrogen by reaction with metals, Glass and silicate-containing materials are attacked
  • Thermal Decomposition : To avoid thermal decomposition, do not overheat.
  • Chemical Class : 8
  • Packing Group : II
  • UN Number : 2922
  • Harmonized System Code : 38249996
  • Sub Class 1 : 6.1
Sales Sheet
Name
Description
File Size
Date
Size
Texture Etch-wafer thinning materials
application/pdf 961.61 KB
5/5/2022
961.61 KB
Texture Etch-wafer thinning materials
application/pdf 961.61 KB
9/14/2022
961.61 KB
Name
Description
File Size
Date
Size
Texture Etch-wafer thinning materials
961.61 KB
5/5/2022
961.61 KB
Texture Etch-wafer thinning materials
961.61 KB
9/14/2022
961.61 KB
Name
Description
File Size
Date
Size
Texture Etch-wafer thinning materials
961.61 KB
5/5/2022
Texture Etch-wafer thinning materials
961.61 KB
9/14/2022
Property
Value
nitric acid
58.5 - 60.5 %
assay hydrofluoric acid (HF)
3.1 - 3.5 %
residue on ignition (SO4)
Max. 5 ppm
silver (Ag)
Max. 0.01 ppm
aluminium (Al)
Max. 0.05 ppm
arsenic (As)
Max. 0.01 ppm
gold (Au)
Max. 0.02 ppm
boron (B)
Max. 0.05 ppm
barium (Ba)
Max. 0.01 ppm
beryllium (Be)
Max. 0.01 ppm
bismuth (Bi)
Max. 0.02 ppm
calcium (Ca)
Max. 0.1 ppm
cadmium (Cd)
Max. 0.01 ppm
cobalt (Co)
Max. 0.01 ppm
chromium (Cr)
Max. 0.01 ppm
copper (Cu)
Max. 0.01 ppm
iron (Fe)
Max. 0.05 ppm
gallium (Ga)
Max. 0.02 ppm
germanium (Ge)
Max. 0.05 ppm
indium (In)
Max. 0.02 ppm
potassium (K)
Max. 0.1 ppm
lithium (Li)
Max. 0.01 ppm
magnesium (Mg)
Max. 0.1 ppm
manganese (Mn)
Max. 0.01 ppm
molybdenum (Mo)
Max. 0.01 ppm
sodium (Na)
Max. 0.1 ppm
nickel (Ni)
Max. 0.02 ppm
lead (Pb)
Max. 0.01 ppm
platinum (Pt)
Max. 0.02 ppm
antimony (Sb)
Max. 0.01 ppm
tin (Sn)
Max. 0.02 ppm
strontium (Sr)
Max. 0.01 ppm
titanium (Ti)
Max. 0.01 ppm
thallium (Tl)
Max. 0.02 ppm
vanadium (V)
Max. 0.01 ppm
zinc (Zn)
Max. 0.05 ppm
zirconium (Zr)
Max. 0.01 ppm
chloride (Cl)
Max. 0.5 ppm
phosphate (PO4)
Max. 0.5 ppm
sulfate (SO4)
Max. 0.5 ppm